BU4506DZ Philips Semiconductors, BU4506DZ Datasheet
BU4506DZ
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BU4506DZ Summary of contents
Page 1
... T 25 ˚ 3 0. kHz 3.0 A kHz Csat PIN CONFIGURATION case CONDITIONS ˚C hs CONDITIONS with heatsink compound in free air 1 Product specification BU4506DZ TYP. MAX. UNIT - 1500 V - 800 3 1.55 1.9 V 300 400 ns ...
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... CONDITIONS Csat / Product specification BU4506DZ MIN. TYP. MAX. UNIT - 2500 - 10 - MIN. TYP. MAX. UNIT - - 1 2.0 mA 7.5 13.5 - 800 - - - 3.0 0.8 0.89 0.98 ...
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... IB2 I 100 F time 0.01 time and Product specification BU4506DZ + 150 v nominal adjust for ICsat Lc D.U.T. LB Cfb Rbe Fig.4. Switching times test circuit . BU4506DF/X/Z hFE VCE = 1V Ths = 25 C Ths = 85 C 0.1 1 Fig.5. High and low DC current gain. BU4506DF/X/Z hFE ...
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... ICsat = 3 A Ths = 85 C Freq = 16 kHz 1 Product specification BU4506DZ Normalised Power Derating PD% with heatsink compound 100 Ths / C Fig.10. Normalised power dissipation. PD% = 100 25˚C BU4506DZ Zth (K/W) 10 0.5 1 0.2 0.1 0.05 0 1E-06 1E-05 1E-04 1E-03 1E-02 1E-01 1E+00 1E+ Fig.11. Transient thermal impedance. 120 ...
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... Fig.12. SOT186A; The seating plane is electrically isolated from all terminals. Notes 1. Refer to mounting instructions for F-pack envelopes. 2. Epoxy meets UL94 V0 at 1/8". January 1999 10.3 max 3.2 3.0 2.8 seating 15.8 19 max. max. plane 3 2 2.54 0.5 5.08 5 Product specification BU4506DZ 4.6 max 2.9 max 6.4 15.8 max 0.6 2.5 1.0 (2x) 0.9 0.7 1.3 Rev 1.000 ...
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... Philips customers using or selling these products for use in such applications their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. January 1999 6 Product specification BU4506DZ Rev 1.000 ...