TS8388BMFSB/QNC3 Atmel Corporation, TS8388BMFSB/QNC3 Datasheet - Page 40

• Manufacturer Part Number: TS8388BMFSB/QNC3
• Description: ADC 8-bit 1 GSPS
• Manufacturer: Atmel Corporation

Enhanced CQFP68
Thermal
Characteristics
Enhanced CQFP68
Thermal Resistance
from Junction to
Case: RTHJC
Heatsink
40
TS8388BF
The CQFP68 has been modified, in order to improve the thermal characteristics:
•
•
Typical value for Rthjc is given to 1.56 C/W.
This value does not include thermal contact resistance between package and external compo-
nent (heatsink or PCBoard).
As an example, 2.0 C/W can be taken for 50 µm of thermal grease.
It is recommended to use an external heatsink, or PCBoard special design.
The stand off has been calculated to permit the simultaneous soldering of the leads and of the
heatspreader with the solder paste.
Figure 48. Enhanced CQFP68 Suggested Assembly
Cooling system efficiency can be monitored using the Temperature Sensing Diode, integrated
in the device.
circuit board
A CuW heatspreader has been added at the bottom of the package.
The die has been electrically isolated with the ALN substrate.
CuW heatspreader
Printed
28.78
24.13
Thermal via
Solid ground plane
2144A–BDC–04/02