FP31QF ETC, FP31QF Datasheet - Page 12

• Manufacturer Part Number: FP31QF
• Description: 2-Watt HFET
• Manufacturer: ETC

Thermal Specifications
1. The thermal resistance is referenced from the hottest part
2. This corresponds to the typical drain biasing condition
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: [phone] • e-mail: [e-mail] • Web site: www.wj.com
Parameter
Operating Case Temperature
Thermal Resistance, Rth
Junction Temperature, Tjc
of the junction to the ground copper on the backside.
of +9V, 450 mA at an 85°C case temperature. A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 160 °C.
Mounting Configuration / Land Pattern
FP31QF
2-Watt HFET
This package may contain lead-bearing materials. The plating material on the pins is SnPb.
(1)
(2)
Outline Drawing
Rating
-40 to +85°C
17.5° C/W
156° C
FP31QF Mechanical Information
100
10
1
0
60
70
MTTF vs. GND Tab Temperature
Tab Temperature (°C)
80
90
100
110
120
The Communications Edge
Specifications and information are subject to change without notice
The component will be lasermarked with a
“FP31QF”
alphanumeric lot code on the top surface of
the package.
Tape and reel specifications for this part will
be located on the website in the “Application
Notes” section.
ESD Rating: Class 1C
Value:
Test:
Standard:
ESD Rating: Class IV
Value:
Test:
Standard:
MSL Rating: Level 1 at +250°C convection reflow
Standard:
The backside paddle is the Source and should be
grounded for thermal and electrical purposes. All
other pins should be grounded on the PCB.
ESD / MSL Information
Functional Pin Layout
Product Marking
Pin
19
3
Passes
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Passes
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
JEDEC Standard J-STD-020
product
Product Information
Drain / RF Output
Gate / RF Input
FUNCTION
1000V to <2000V
1000V
label
November 2004
with
TM
an