SC1211 Semtech Corporation, SC1211 Datasheet - Page 10

• Manufacturer Part Number: SC1211
• Description: Combi-SenseTM Synchronous MOSFET Driver
• Manufacturer: Semtech Corporation

Filters for Supply Power
For VREG pin of the SC1211, it is recommended to use
a 1uF to 4.7uF, 25V rating ceramic capacitor for
decoupling.
LAYOUT GUIDELINES
The switching regulator is a high di/dt power circuit. Its
Printed Circuit Board (PCB) layout is critical. A good lay-
out can achieve an optimum circuit performance while
minimized the component stress, resulting in better sys-
tem reliability. For a multi-phase voltage regulator, the
SC1211 driver, FETs, inductor, and supply decoupling
capacitors in each phase have to be considered as a
whole during PCB layout. Refer to Semtech SC2643VX/
SC1211 EVB Layout Guideline.
For the SC1211 driver, the following guidelines are typi-
cally recommended during PCB layout:
1. Place the SC1211 close to the FETs for shortest gate
drive traces and ground return paths.
2. Connect bypass capacitors as close as possible to
decoupling pins (VREG and VIN) and PGND. The trace
length of the decoupling capacitor on VREG pin should
be no more than 0.2” (5mm).
3. Locate the components of the bootstrap circuit close
to the SC1211.
SOLDERING CONSIDERATION
The exposed die pad of the SC1211 is used for ground
POWER MANAGEMENT
Applications Information (Cont.)
2003 Semtech Corp.
Solder Pad
Vias
Copper
Solder Mask
10
return and thermal release of the driver. The pad must
be soldered to the ground plane that is further connected
to the system ground in the inner layer through multiple
vias. For better electrical and thermal performance, it is
recommended to use all copper available under the driver
as the ground plane, and place the vias as close as pos-
sible to the solder pad. Meanwhile, the vias have to be
masked out to prevent solder leakage during reflow. The
layout arrangement is detailed in the above figure, which
also can be found in the “Land Pattern – Power SOIC-8”
section.
www.semtech.com
SC1211