upd4726 Renesas Electronics Corporation., upd4726 Datasheet
upd4726
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upd4726 Summary of contents
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The PD4726 is a high-voltage silicon gate CMOS line driver/receiver conforming to EIA/TIA-232-E Standards. It contains a DC/DC converter and can operate with single power supply. In addition also provided with ancillary functions such as ...
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BLOCK DIAGRAM/PIN CONFIGURATION (Top View) + IN1 D IN2 D IN3 D IN4 R OUT1 R OUT2 R OUT3 R OUT4 R OUT5 R OUT6 R OUT7 Notes 1. V ...
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TRUTH TABLE Drivers STBY OUT L Z Standby mode (DC/DC converter stops Space level output Mark level output Receivers R IN STBY ...
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ABSOLUTE MAXIMUM RATING (T Parameter Symbol Supply voltage V CC Driver input voltage D IN Receiver input voltage R IN Control input voltage V IN (STBY, EN) Driver output voltage D OUT Receiver output voltage R OUT Input current (D ...
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ELECTRICAL SPECIFICATIONS (CHIP) (Unless otherwise specified + Parameter Symbol Circuit current I CC1 Circuit current I CC2 Circuit current in standby I CC3 mode (standby mode 1) Circuit current in standby I CC4 ...
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ELECTRICAL SPECIFICATIONS (DRIVERS) (Unless otherwise specified + Parameter Symbol Input voltage, low V IL Input voltage, high V IH Input current, low I IL Input current, high I IH Output voltage V DO ...
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Note 9. Test point V CC STBY OUT V DO The driver output is undefined during the standby output transition time t the standby output transition time t after the standby mode has been ...
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ELECTRICAL SPECIFICATIONS (RECEIVERS) (Unless otherwise specified 4 Parameter Symbol Output voltage, low V OL1 (STBY = H) Output voltage, high V OH1 (STBY = H) Output voltage, low V OL2 (STBY = L) ...
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Note 12. Test point OUT V OL STBY = L Note 13. Test point V CC STBY OUT V OL The receiver output is undefined during the ...
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PIN PLASTIC SHRINK SOP (300 mil NOTE Each lead centerline is located within 0.10 mm (0.004 inch) of its true position (T.P.) at maximum material condition detail of lead ...
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RECOMMENDED SOLDERING CONDITIONS Solder and mount the PD4726 under the following recommended conditions. Consult NEC for conditions other than those recommended. PD4726GS-BAF Soldering method Infrared ray reflow Peak temperature of package surface: 235 C, Reflow time: Within 30 sec (210 ...
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No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC ...