upd7566a Renesas Electronics Corporation., upd7566a Datasheet - Page 51

• Manufacturer Part Number: upd7566a
• Description: 4-bit Single-chip Microcomputer
• Manufacturer: Renesas Electronics Corporation.

11.
device mounting technology manual" (IEI-1207).
Caution Do not use one soldering method in combination with another (however, pin partial heating can be
Caution The wave soldering must be performed at the pin part only. Note that the solder must not be directly
Infrared Reflow
VPS
Wave Soldering
Pin Partial Heating
Wave Soldering
(Only for pin part)
Pin Partial Heating
For the PD7566A, soldering must be performed under the following conditions.
For details of recommended conditions for surface mounting, refer to information document "Semiconductor
For other soldering methods, please consult with NEC sales personnel.
Soldering Method
Soldering Method
PD7566AG-XXX: 24-pin plastic SOP (300 mil)
PD7566AG(A)-XXX: 24-pin plastic SOP (300 mil)
PD7566ACS-XXX: 24-pin plastic shrink DIP (300 mil)
PD7566ACS(A)-XXX: 24-pin plastic shrink DIP (300 mil)
RECOMMENDED SOLDERING CONDITIONS
performed with other soldering methods).
contacted to the package body.
Package peak temperature 230 C, Time: 30 secondes max.
(210 C min.), Number of soldering operations: 1,
Package peak temperature 215 C, Time: 40 seconds max.
(200 C min.), Number of soldering operations: 1
Solder bath temperature: 260 C max., Time: 10 seconds max.,
Preparatory heating temperature: 120 C max.
(Package surface temperature)
Pin temperature: 300 C max., Time: 3 seconds max. (Per side)
Solder bath temperature: 260 C max., Time: 10 seconds max.
Pin temperature: 300 C max., Time: 3 seconds max. (Per pin)
Table 11-1 Soldering Conditions of Surface Mount Type
Table 11-2 Soldering Conditions of Through-Hole Type
Soldering Conditions
Soldering Conditions
PD7566A, 7566A(A)
Reference Code
VP15-00-1
WS60-00-1
IR30-00-1
Recommended
Conditions
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