S25FL016A Meet Spansion Inc., S25FL016A Datasheet - Page 32

• Manufacturer Part Number: S25FL016A
• Description: 16 Megabit Cmos 3.0 Volt Flash Memory With 50 Mhz Spi Bus Interface
• Manufacturer: Meet Spansion Inc.

17. Physical Dimensions
17.1
32
3
E1
4
PACKAGE
E1/2
SYMBOL
SOC008 wide—8-pin Plastic Small Outline Package (208 mils Body Width)
JEDEC
A
A1
A2
b1
E1
L1
L2
c1
θ1
θ2
D
N
A
b
c
E
e
L
θ
A2
A1
e
0.0075
SOC 008 (inches)
0.069
0.002
0.067
0.014
0.013
0.006
0.020
MIN
0˚
5˚
0.315 BSC
0.208 BSC
0.208 BSC
.050 BSC
.055 REF
.010 BSC
8
0˚
A
B
0.0098
0.0095
0.085
0.075
0.019
0.018
0.008
0.030
MAX
15˚
3
8˚
D
4
5
1.753
0.051
0.356
0.330
0.191
0.152
0.508
5
MIN
1.70
0˚
5˚
SOC 008 (mm)
1.40 REF
0.25 BSC
8.001 BSC
1.27 BSC
5.283 BSC
5.283 BSC
8
0˚
0.10
b
0.25
2.159
0.249
0.483
0.457
0.241
0.203
0.762
MAX
1.91
15˚
8˚
0.20 C
E/2
9
C
M
C
D
E
C
A-B
A-B
0.10
SEATING PLANE
DETAIL B
S25FL016A
0.33 C
D
C
SEE
D a t a
1.
2.
3.
4.
5.
6.
7.
8.
9.
10. LEAD COPLANARITY SHALL BE WITHIN 0.10 mm AS MEASURED
NOTES:
.
ALL DIMENSIONS ARE IN BOTH INCHES AND MILLMETERS.
DIMENSIONING AND TOLERANCING PER ASME Y14.5M - 1994.
DIMENSION D DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH,
PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.15 mm
PER END. DIMENSION E1 DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 mm PER SIDE. D AND E1
DIMENSIONS ARE DETERMINED AT DATUM H.
THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE
BOTTOM. DIMENSIONS D AND E1 ARE DETERMINED AT THE
OUTMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF
MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD
FLASH. BUT INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
DATUMS A AND B TO BE DETERMINED AT DATUM H.
"N" IS THE MAXIMUM NUMBER OF TERMINAL POSITIONS FOR
THE SPECIFIED PACKAGE LENGTH.
THE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD
BETWEEN 0.10 TO 0.25 mm FROM THE LEAD TIP.
DIMENSION "b" DOES NOT INCLUDE DAMBAR PROTRUSION.
ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.10 mm TOTAL
IN EXCESS OF THE "b" DIMENSION AT MAXIMUM MATERIAL
CONDITION. THE DAMBAR CANNOT BE LOCATED ON THE
LOWER RADIUS OF THE LEAD FOOT.
THIS CHAMFER FEATURE IS OPTIONAL. IF IT IS NOT PRESENT,
THEN A PIN 1 IDENTIFIER MUST BE LOCATED WITHIN THE INDEX
AREA INDICATED.
FROM THE SEATING PLANE.
H
S h e e t
C
H
q
1
DETAIL B
PLATING
METAL
L1
BASE
S25FL016A_00_C3 January 7, 2008
WITH
L
3432 \ 16-038.03 \ 10.28.04
c
A
q
A
SECTION A-A
2
0.07 R MIN.
q
(b)
b1
7
L2
SEATING
PLANE
GAUGE
PLANE
c1