upc8233tk Renesas Electronics Corporation., upc8233tk Datasheet - Page 12

• Manufacturer Part Number: upc8233tk
• Description: Sige C Low Noise Amplifier For Gps/mobile Communications
• Manufacturer: Renesas Electronics Corporation.

NOTES ON CORRECT USE
RECOMMENDED SOLDERING CONDITIONS
methods and conditions other than those recommended below, contact your nearby sales office.
12
Infrared Reflow
Wave Soldering
Partial Heating
Caution Do not use different soldering methods together (except for partial heating).
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).
(3) The bypass capacitor should be attached to V
(4) Do not supply DC voltage to INPUT pin.
This product should be soldered and mounted under the following recommended conditions.
Soldering Method
All the ground terminals must be connected together with wide ground pattern to decrease impedance
difference.
Peak temperature (package surface temperature)
Time at peak temperature
Time at temperature of 220°C or higher
Preheating time at 120 to 180°C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (molten solder temperature)
Time at peak temperature
Preheating temperature (package surface temperature) : 120°C or below
Maximum number of flow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (terminal temperature)
Soldering time (per side of device)
Maximum chlorine content of rosin flux (% mass)
Data Sheet PU10706EJ01V0DS
Soldering Conditions
CC
line.
: 260°C or below
: 10 seconds or less
: 60 seconds or less
: 120±30 seconds
: 3 times
: 0.2%(Wt.) or below
: 260°C or below
: 10 seconds or less
: 1 time
: 0.2%(Wt.) or below
: 350°C or below
: 3 seconds or less
: 0.2%(Wt.) or below
Condition Symbol
μ
WS260
HS350
For soldering
IR260
PC8233TK