sy89223l Micrel Semiconductor, sy89223l Datasheet - Page 5

• Manufacturer Part Number: sy89223l
• Description: Sy89223l 3.3v Dual Differential Lvpecl-to-lvttl Translator
• Manufacturer: Micrel Semiconductor

Micrel, Inc.
M9999-051805
[e-mail] or [phone]
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can
reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into
the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser’s
The information furnished by Micrel in this datasheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use.
use or sale of Micrel Products for use in life support appliances, devices or systems is at Purchaser’s own risk and Purchaser agrees to fully indemnify
8 LEAD ULTRA-SMALL EPAD- Micro LeadFrame™ (MLF-8)
Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.
MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA
Package Notes:
Note 1.
Note 2.
Note 3.
TEL
+ 1 [phone]
Package meets level two qualification.
All parts are dry-packaged before shipment.
Exposed pads must be soldered to a ground plane, of the same potential as the device GND
pin, for proper thermal management.
(Always solder, or equivalent, the exposed pad to the PCB)
Heat Dissipation
PCB Thermal Consideration for 8-Pin MLF™ Package
Micrel for any damages resulting from such use or sale.
FAX
© 2005 Micrel, Incorporated.
+ 1 [phone]
5
CompSide Island
Heat Dissipation
Heavy Copper Plane
Heavy Copper Plane
WEB
http://www.micrel.com
Package
EP- Exposed Pad
Die
V
V
EE
EE
Precision Edge
SY89223L
®