sy89222l Micrel Semiconductor, sy89222l Datasheet - Page 5

no-image

sy89222l

Manufacturer Part Number
sy89222l
Description
Sy89222l 3.3v Dual Ttl-to-differential Pecl Translator
Manufacturer
Micrel Semiconductor
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
sy89222lMITR
Manufacturer:
MICREL
Quantity:
4 662
Micrel, Inc.
M9999-051805
hbwhelp@micrel.com or (408) 955-1690
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can
reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into
the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser’s
The information furnished by Micrel in this datasheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use.
use or sale of Micrel Products for use in life support appliances, devices or systems is at Purchaser’s own risk and Purchaser agrees to fully indemnify
8 LEAD ULTRA-SMALL EPAD- Micro LeadFrame™ (MLF-8)
Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.
Package Notes:
Note 1.
Note 2.
Note 3.
MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA
Package meets Level 2 qualification.
All parts are dry-packaged before shipment.
Exposed pads must be soldered to a ground plane, of the same potential as the GND plane for proper
thermal management.
TEL
+ 1 (408) 944-0800
Heat Dissipation
PCB Thermal Consideration for 8-Pin MLF™ Package
Micrel for any damages resulting from such use or sale.
FAX
© 2005 Micrel, Incorporated.
+ 1 (408) 474-1000
5
CompSide Island
Heat Dissipation
Heavy Copper Plane
Heavy Copper Plane
WEB
http://www.micrel.com
Package
EP- Exposed Pad
Die
V
V
EE
EE
Precision Edge
SY89222L
®

Related parts for sy89222l