qt1101 Quantum Research Group, qt1101 Datasheet - Page 14

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qt1101

Manufacturer Part Number
qt1101
Description
10 Key Qtouch? Sensor Ic
Manufacturer
Quantum Research Group
Datasheet

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4.8 Mechanical - 32-QFN Package
Lq
Note that there is no functional requirement for the large pad on the underside of the 32-QFN
package to be soldered to the substrate. If the final application does require this area to be soldered
for mechanical reasons, the pad(s) to which it is soldered to must be isolated and contained under
the 32-QFN footprint only.
Symbol Minimum Nominal Maximum
D2
A1
E2
C
D
A
E
b
e
L
y
Dimensions In Millimeters
0.70
0.00
0.18
4.90
3.05
4.90
3.05
0.30
0.00
-
-
0.20 REF
0.02
0.25
5.00
5.00
0.50
0.40
-
-
-
-
0.075
0.90
0.05
0.32
5.10
3.65
5.10
3.65
0.50
-
-
14
QT1101 R4.06/0806

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