ncn6001 ON Semiconductor, ncn6001 Datasheet
ncn6001
Manufacturer Part Number
ncn6001
Description
Compact Smart Card Interface Ic
Manufacturer
ON Semiconductor
Datasheet
1.NCN6001.pdf
(34 pages)
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NCN6001
Compact Smart Card
Interface IC
interface applications. The device handles any type of smart card
through a simple and flexible microcontroller interface. On top of that,
thanks to the built−in chip select pin, several couplers can be
connected in parallel.
applications, with high extended battery life coming from extremely
low quiescent current.
Features
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Typical Applications
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*For additional information on our Pb−Free strategy and soldering details, please
© Semiconductor Components Industries, LLC, 2006
January, 2006 − Rev. 3
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
The NCN6001 is an integrated circuit dedicated to the smart card
The device is particularly suited for low cost, low power
Card Operation
Low State
Frequency Range
100% Compatible with ISO 7816−3, EMV and GIE−CB Standards
Fully GSM Compliant
Wide Battery Supply Voltage Range: 2.7 < V
Programmable CRD_VCC Supply Handles 1.8 V, 3.0 V or 5.0 V
Programmable Rise and Fall Card Clock Slopes
Programmable Card Clock Divider
Built−in Chip Select Logic Allows Parallel Coupling Operation
ESD Protection on Card Pins (8.0 kV, Human Body Model)
Supports up to 40 MHz Input Clock
Built−in Programmable CRD_CLK Stop Function Handles Run or
Programmable CRD_CLK Slopes to Cope with Wide Operating
Fast CRD_VCC Turn−on and Turn−off Sequence
These are Pb−Free Devices*
E−Commerce Interface
Automatic Teller Machine (ATM) Smart Card
Point of Sales (POS) System
Pay TV System
CC
< 5.5 V
1
NCN6001DTBR2
NCN6001DTBR2G TSSOP−20* 2500 Tape & Reel
†For information on tape and reel specifications,
*This package is inherently Pb−Free.
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Device
CLK_SPI
EN_RPU
(Note: Microdot may be in either location)
CLK_IN
Lout_L
MOSI
MISO
V
INT
ORDERING INFORMATION
I/O
CS
CC
1
A
L
Y
W
G
MARKING DIAGRAM
PIN CONNECTIONS
20
10
http://onsemi.com
1
2
3
4
5
6
7
8
9
1
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Top View)
TSSOP−20* 2500 Tape & Reel
Package
ALYWG
6001
NCN
Publication Order Number:
G
DTB SUFFIX
CASE 948E
TSSOP−20
17
12
20
19
18
16
15
14
13
11
Shipping
CRD_IO
CRD_RST
CRD_DET
CRD_CLK
GND
C4/S0
C8/S1
CRD_VCC
Lout_H
PWR_GND
NCN6001/D
†