tb2924afg TOSHIBA Semiconductor CORPORATION, tb2924afg Datasheet
tb2924afg
Available stocks
Related parts for tb2924afg
tb2924afg Summary of contents
Page 1
... However, care should be exercised so that it will not be really exceeded, considering the board’s thermal resistance, ambient temperature, average output power and so forth. Toshiba has verified that the TB2924AFG works properly without a heatsink on the Toshiba PC board for up to 10-watt by 2-channel output typical (V with a sine-wave input. • ...
Page 2
... Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purpose. BOOT PW Pre (−) V GND2 CC2 BOOT PW Pre 1 (−) V GND1 CC1 2 TB2924AFG Pre OSC FEED FEED OSC OSC V SW IN2 2 (−) 2 (+) OUT AGC ...
Page 3
... No-connection pin (not connected inside the IC) 32 OUT2 (−) CH2 main amplifier output pin (− GND2 GND for CH2 main amplifier output stage 34 OUT2 (+) CH2 main amplifier output pin (+) 35 BOOT2 (+) CH2 bootstrap pin (+) 36 NC No-connection pin (not connected inside the IC) Description 3 TB2924AFG 2007-01-26 ...
Page 4
... Turn the oscillator on “L” (GND): Turn the oscillator off (Example with multiple ICs) Pre OSC SW OSC OUT Master Pre GND Open OSC IN OSC SW OSC OUT Slave IC 4 TB2924AFG ) when open, while V for the built- OSC IN 2007-01-26 ...
Page 5
... Turn on the power supply after turning on muting. Timing charts may be simplified for explanatory purpose. 6. Board Mounting Consideration The switching of the TB2924AFG is controlled with a rectangular-wave signal of approximately 200 kHz (typical recommended to place the TB2924AFG far from the tuner portion, etc. that might be affected. 5 TB2924AFG ...
Page 6
... Before using, creating and/or producing designs, refer to and comply with the precautions and conditions set forth in this documents. (Ta = 25°C) Symbol Rating Unit o(peak) P 14.7 (Note − °C opr −55 to 150 T °C stg 6 TB2924AFG 2007-01-26 ...
Page 7
... MUTE off V 1 Muted MUTE on Amplifier operating V 1 STB off (not standby Amplifier stopped (standby on) STB Oscillator operating OSC Oscillator stopped OSC off 7 TB2924AFG = 8 Ω 25°C) L Min Typ. Max Unit ⎯ ⎯ 9 10.5 ⎯ 12 ⎯ 11.5 13 ⎯ 18 19.5 ⎯ ...
Page 8
... Pre NC 1 (−) V GND1 Rip/F NC CC1 Heat sink 10 C21 C24 0.1 µF 4.7 µF OUT1 (−) 1 µF C22 330 µF C23 LPF * 8 TB2924AFG V CC 2200 µF 330 µF IN2 C13 1 µF C14 OSC IN2 FEED FEED OSC OSC Pre SW 2 (− ...
Page 9
... NC BOOT PW Pre 2 (−) V GND2 CC2 BOOT PW Pre NC 1 (−) V GND1 Rip/F NC CC1 Heat sink 10 0.1 µF 4.7 µF OUT1 (−) 1 µF 9 TB2924AFG V CC IN2 1 µ OSC IN2 FEED FEED OSC OSC Pre SW 2 (−) 2 (+) OUT FEED FEED IN1 1 (− ...
Page 10
... Toshiba’s PC Board Layout (Back side) (Mounting side) 10 TB2924AFG 2007-01-26 ...
Page 11
... kHz Output LPF 10000 100000 kHz Ω kHz Ω TB2924AFG THD – OUT CC OUT1_12 V OUT2_12 V 0.03 0.1 0 (W) OUT P _V OUT CC OUT1 OUT2 ...
Page 12
... −20 −40 −60 −80 −100 3.0 3 Ω −10 V rip = 0.775 Vrms −20 −30 −40 −50 −60 −70 −80 100000 10 12 TB2924AFG I – V CCQ (V) CC ATT – V MUTE MUTE 0.5 1.0 1.5 2.0 V (V) MUTE C.T. – OUT2 → ...
Page 13
... 0.8 Filt: DIN_AUDIO 0.6 0.4 0 100 620 Ω Ω −10 V rip = 0.775 Vrms −20 −30 −40 −50 −60 10000 10 100 150 13 TB2924AFG V – OUT1 OUT2 1000 10000 R (Ω) g R.R. – OUT2 OUT1 1000 10000 100000 R (Ω) g 2007-01-26 ...
Page 14
... Package Dimensions Weight: 0.85 g (typ.) 14 TB2924AFG 2007-01-26 ...
Page 15
... In addition, depending on the IC, the use of silicon rubber may be prohibited. Check whether the use of silicon rubber is prohibited for the IC you intend to use, or not. For details of power IC heat radiation design and heat sink installation, refer to individual technical datasheets or IC databooks. 15 TB2924AFG 2007-01-26 ...
Page 16
... R-type flux (2) Use of Sn-3.0Ag-0.5Cu solder Bath · solder bath temperature = 245°C · dipping time = 5 seconds · the number of times = once · use of R-type flux 021023_D 021023_B 060106_Q 16 TB2924AFG 060925EBF 060925_E 2007-01-26 ...