24lc32a

Manufacturer Part Number24lc32a
Description32k I2c Serial Eeprom
ManufacturerMicrochip Technology Inc.
24lc32a datasheet
 


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24AA32A/24LC32A
32K I
Device Selection Table
Part
V
Max. Clock
CC
Number
Range
Frequency
24AA32A
1.7-5.5
400 kHz
24LC32A
2.5-5.5
400 kHz
Note 1:
100 kHz for V
<2.5V
CC
Features:
• Single supply with operation down to 1.7V for
24AA32A devices, 2.5V for 24LC32A devices
• Low-power CMOS technology:
- Active current 1 mA, typical
- Standby current 1 μA, typical
2
• 2-wire serial interface, I
C™ compatible
• Cascadable up to eight devices
• Schmitt Trigger inputs for noise suppression
• Output slope control to eliminate ground bounce
• 100 kHz and 400 kHz clock compatibility
• Page write time 5 ms max.
• Self-timed erase/write cycle
• 32-byte page write buffer
• Hardware write-protect
• ESD protection > 4,000V
• More than 1 million erase/write cycles
• Data retention > 200 years
• Factory programming available
• Packages include 8-lead PDIP, SOIC, TSSOP,
MSOP and DFN
• Pb-free and RoHS compliant
• Temperature ranges:
- Industrial (I):
-40°C to +85°C
- Automotive (E): -40°C to +125°C
*24XX32A is used in this document as a generic part
number for the 24AA32A/24LC32A devices.
© 2007 Microchip Technology Inc.
2
C
Serial EEPROM
Description:
Temp.
The Microchip Technology Inc. 24AA32A/24LC32A
Ranges
(24XX32A*) is a 32 Kbit Electrically Erasable PROM.
The device is organized as a single block of 4K x 8-bit
(1)
I
memory with a 2-wire serial interface. Low-voltage
I, E
design permits operation down to 1.7V, with standby
and active currents of only 1 μA and 1 mA,
respectively. It has been developed for advanced, low-
power applications such as personal communications
or data acquisition. The 24XX32A also has a page write
capability for up to 32 bytes of data. Functional address
lines allow up to eight devices on the same bus, for up
to 256 Kbits address space. The 24XX32A is available
in the standard 8-pin PDIP, surface mount SOIC,
TSSOP, 2x3 DFN and MSOP packages.
Package Types
PDIP, MSOP
A0
1
A1
2
A2
3
V
4
SS
Block Diagram
I/O
Control
Logic
I/O
SCL
SDA
Vcc
V
SS
SOIC, TSSOP
8
V
CC
1
8
A0
V
7
WP
2
7
A1
WP
6
SCL
3
6
A2
SCL
5
SDA
4
5
V
SS
SDA
DFN
1
A0
8
V
CC
7
WP
2
A1
6
SCL
A2
3
V
5
4
SDA
SS
WP
A0 A1
A2
HV Generator
Memory
EEPROM
XDEC
Control
Array
Logic
Page Latches
YDEC
Sense Amp.
R/W Control
DS21713H-page 1
CC

24lc32a Summary of contents

  • Page 1

    ... Note 1: 100 kHz for V <2.5V CC Features: • Single supply with operation down to 1.7V for 24AA32A devices, 2.5V for 24LC32A devices • Low-power CMOS technology: - Active current 1 mA, typical - Standby current 1 μA, typical 2 • 2-wire serial interface, I C™ compatible • Cascadable up to eight devices • ...

  • Page 2

    ... ELECTRICAL CHARACTERISTICS (†) Absolute Maximum Ratings V .............................................................................................................................................................................6.5V CC All inputs and outputs w.r.t. V ......................................................................................................... -0. Storage temperature ...............................................................................................................................-65°C to +150°C Ambient temperature with power applied ................................................................................................-40°C to +125°C ESD protection on all pins ......................................................................................................................................................≥ † NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device ...

  • Page 3

    ... This parameter is not tested but ensured by characterization. For endurance estimates in a specific application, please consult the Total Endurance™ Model which can be obtained on Microchip’s web site at www.microchip.com. © 2007 Microchip Technology Inc. 24AA32A/24LC32A Industrial (I -40°C to +85° Automotive (E -40° ...

  • Page 4

    ... FIGURE 1-1: BUS TIMING DATA 5 SCL 7 3 SDA SDA OUT WP DS21713H-page (protected) 11 (unprotected © 2007 Microchip Technology Inc. ...

  • Page 5

    ... SCL SDA Start Condition © 2007 Microchip Technology Inc. 24AA32A/24LC32A 3.4 Data Valid (D) The state of the data line represents valid data when, after a Start condition, the data line is stable for the duration of the high period of the clock signal. The data on the line must be changed during the low period of the clock signal ...

  • Page 6

    ... Device Addressing A control byte is the first byte received following the Start condition from the master device (Figure 3-2). The control byte consists of a four-bit control code. For the 24XX32A, this is set as ‘1010’ binary for read and write operations. The next three bits of the control byte are the Chip Select bits (A2, A1, A0) ...

  • Page 7

    ... Write command, the internal address counter will point to the address location following the one that was just written. © 2007 Microchip Technology Inc. 24AA32A/24LC32A 4.2 Page Write The write control byte, word address and the first data byte are transmitted to the 24XX32A in the same way byte write ...

  • Page 8

    ... FIGURE 4-1: BYTE WRITE S Bus Activity T Control Master SDA Line Bus Activity x = “don’t care” bit FIGURE 4-2: PAGE WRITE S T Control Bus Activity A Byte Master SDA Line Bus Activity “don’t care” bit ...

  • Page 9

    ... If the cycle is complete, the device will return the ACK and the master can then proceed with the next Read or Write command. See Figure 5-1 for flow diagram of this operation. © 2007 Microchip Technology Inc. 24AA32A/24LC32A FIGURE 5-1: ACKNOWLEDGE POLLING FLOW Send Write Command ...

  • Page 10

    ... READ OPERATION Read operations are initiated in the same way as write operations, with the exception that the R/W bit of the control byte is set to ‘1’. There are three basic types of read operations: current address read, random read and sequential read. 6.1 Current Address Read ...

  • Page 11

    ... Bus Activity “don’t care” bit FIGURE 6-3: SEQUENTIAL READ Bus Activity Control Master Byte SDA Line Bus Activity © 2007 Microchip Technology Inc. 24AA32A/24LC32A S T Address Address A High Byte Low Byte ...

  • Page 12

    ... PIN DESCRIPTIONS The descriptions of the pins are listed in Table 7-1. TABLE 7-1: PIN FUNCTION TABLE Name PDIP SOIC TSSOP SDA 5 5 SCL 7.1 A0, A1, A2 Chip Address Inputs The A0, A1 and A2 inputs are used by the 24XX32A for multiple device operation ...

  • Page 13

    ... XXXX TYWW NNN 8-Lead 2x3 DFN XXX YWW NN 8-Lead MSOP XXXXXT YWWNNN © 2007 Microchip Technology Inc. 24AA32A/24LC32A Example: e 13F 3 0527 Example: 24LC32AI e 3 0527 13F Example: 24LC32A e 3 I/SM 052713F Example: 4LA I527 13F Example: 264 527 13 Example: 4L32AI 52713F DS21713H-page 13 ...

  • Page 14

    ... Part Number 24AA32A 24LC32A Note Temperature grade (I, E) Legend: XX...X Part number or part number code T Temperature ( Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code (2 characters for small packages) ...

  • Page 15

    ... Significant Characteristic. 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. © 2007 Microchip Technology Inc. 24AA32A/24LC32A ...

  • Page 16

    ... Plastic Small Outline (SN or OA) – Narrow, 3.90 mm Body [SOIC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging N NOTE Number of Pins Pitch Overall Height Molded Package Thickness § Standoff Overall Width ...

  • Page 17

    ... Mold Draft Angle Top Mold Draft Angle Bottom Notes: 1. SOIJ, JEITA/EIAJ Standard, formerly called SOIC. 2. § Significant Characteristic. 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side. © 2007 Microchip Technology Inc. 24AA32A/24LC32A β Units ...

  • Page 18

    ... Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D N NOTE Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width ...

  • Page 19

    ... Package may have one or more exposed tie bars at ends. 3. Package is saw singulated. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. © 2007 Microchip Technology Inc. 24AA32A/24LC32A EXPOSED PAD ...

  • Page 20

    ... Plastic Micro Small Outline Package (MS or UA) [MSOP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D N NOTE Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width ...

  • Page 21

    ... REVISION HISTORY Revision D Corrections to Section 1.0, Electrical Characteristics. Revision E Added DFN package. Revision F Revised Sections 4.3, 7.2 and 7.4. Revision G Replaced 2x3 DFN (MC) Package Revision H Changed 1.8V to 1.7V; Revised Features Section; Replaced Package Drawings; Deleted TSSOP; Revised Product ID Section. © 2007 Microchip Technology Inc. 24AA32A/24LC32A Rotated DS21713H-page 21 ...

  • Page 22

    ... NOTES: DS21713H-page 22 © 2007 Microchip Technology Inc. ...

  • Page 23

    ... To register, access the Microchip web site at www.microchip.com, click on Customer Change Notification and follow the registration instructions. © 2007 Microchip Technology Inc. 24AA32A/24LC32A CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels: • Distributor or Representative • ...

  • Page 24

    ... Telephone: (_______) _________ - _________ Application (optional): Would you like a reply? Y Device: 24AA32A/24LC32A Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs you find the organization of this document easy to follow? If not, why? 4 ...

  • Page 25

    ... To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. X /XX Temperature Package Device Range Device: 24AA32A: 1.7V, 32 Kbit I 24AA32AT: 1.7V, 32 Kbit I (Tape and Reel) 24LC32A: 2.5V, 32 Kbit I 24LC32AT: 2.5V, 32 Kbit I (Tape and Reel) Temperature I = -40°C to +85°C Range -40°C to +125°C Package Plastic DIP (300 mil body), 8-lead SN = Plastic SOIC (3 ...

  • Page 26

    ... NOTES: DS21713H-page 26 © 2007 Microchip Technology Inc. ...

  • Page 27

    ... Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. © 2007 Microchip Technology Inc. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, K ...

  • Page 28

    ... Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 © 2007 Microchip Technology Inc. EUROPE Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris ...