lt3011emse Linear Technology Corporation, lt3011emse Datasheet - Page 15

• Manufacturer Part Number: lt3011emse
• Description: 50ma, 3v To 80v Low Dropout Micropower Linear Regulator With Pwrgd
• Manufacturer: Linear Technology Corporation

PACKAGE DESCRIPTION
3.50 ±0.05
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
2.15 ±0.05
OF (WEED-2). CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS
OF VARIATION ASSIGNMENT
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
0.25 ± 0.05
1.65 ±0.05
(2 SIDES)
(.0165 .0015)
0.42 0.038
TYP
GAUGE PLANE
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
(.007)
0.18
RECOMMENDED SOLDER PAD LAYOUT
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
(.206)
5.23
MIN
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
2.38 ±0.05
(2 SIDES)
2.845 0.102
(.112 .004)
(.010)
0.254
0.50
BSC
DETAIL “A”
DETAIL “A”
0.675 ±0.05
12-Lead Plastic MSOP , Exposed Die Pad
1.651 0.102
(.065 .004)
PACKAGE
OUTLINE
(Reference LTC DWG # 05-08-1666 Rev B)
(.0256)
0.65
BSC
10-Lead Plastic DFN (3mm × 3mm)
0 – 6 TYP
(Reference LTC DWG # 05-08-1699)
0.53 0.152
(.021 .006)
0.889 0.127
(.035 .005)
(.126 – .136)
(SEE NOTE 6)
3.20 – 3.45
SEATING
PLANE
TOP MARK
MSE Package
DD Package
PIN 1
0.200 REF
(.009 – .015)
0.22 – 0.38
4.90 0.152
(.193 .006)
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TYP
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
TOP AND BOTTOM OF PACKAGE
(.043)
MAX
1.10
EXPOSED PAD OPTION
(.0256)
1
0.650
12
BSC
BOTTOM VIEW OF
12 11 10 9 8 7
1 2 3 4 5 6
2.845
4.039 0.102
(.112 .004)
(.159 .004)
(NOTE 3)
0.102
3.00 ±0.10
0.75 ±0.05
(4 SIDES)
7
6
DETAIL “B”
(.118 .004)
3.00 0.102
(NOTE 4)
0.406 0.076
(.016 .003)
MSOP (MSE12) 0608 REV B
0.00 – 0.05
(.034)
0.86
REF
0.1016 0.0508
(.004 .002)
REF
1.65 ± 0.10
(2 SIDES)
NO MEASUREMENT PURPOSE
THE LEADFRAME FEATURE.
CORNER TAIL IS PART OF
FOR REFERENCE ONLY
BOTTOM VIEW—EXPOSED PAD
DETAIL “B”
0.12 REF
5
R = 0.115
6
2.38 ±0.10
(2 SIDES)
TYP
0.35
REF
10
1
0.50 BSC
0.25 ± 0.05
± 0.10
0.38
(DD) DFN 1103
LT3011
15
3011f