tb62702f TOSHIBA Semiconductor CORPORATION, tb62702f Datasheet

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tb62702f

Manufacturer Part Number
tb62702f
Description
10bit Serial In Parallel Out Shift Register / Latch / 10segment Led Drivers
Manufacturer
TOSHIBA Semiconductor CORPORATION
Datasheet

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Part Number:
tb62702fG
Manufacturer:
TOSHIBA/东芝
Quantity:
20 000
10BIT SERIAL−IN PARALLEL−OUT SHIFT REGISTER / LATCH / 10SEGMENT LED
DRIVERS
The TB62702P, TB62702F are specifically designed for
10−Segment LED Drivers and LED display. And these are
monolithic integrated circuits designed to be used together with
Bi−CMOS (DMOS) integrated circuit. The devices consist of a
10bit shift Register and 10bit Latches, and 10bit DMOS
structures.
FEATURES
PIN CONNECTION
10bit serial−in parallel−out shift register / latch / 10segment
LED driver (Bi−CMOS process)
CMOS compatible inputs
Open−drain DMOS outputs
Low steady−state power consumption
Serial data output for cascade operation
Packge ; P−type DIP−20−P−300A
F−type SOP−20−P−300
TOSHIBA Bi−CMOS INTEGRATED CIRCUIT SILICON MONOLITHIC
TB62702P,TB62702F
(TOP VIEW)
1
Weight
DIP20-P-300-2.54A: 2.25 g (typ.)
SOP20-P-300-1.27: 0.48 g (typ.)
TB62702P
TB62702F
TB62702P/F
2006-06-14

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tb62702f Summary of contents

Page 1

... TB62702P,TB62702F 10BIT SERIAL−IN PARALLEL−OUT SHIFT REGISTER / LATCH / 10SEGMENT LED DRIVERS The TB62702P, TB62702F are specifically designed for 10−Segment LED Drivers and LED display. And these are monolithic integrated circuits designed to be used together with Bi−CMOS (DMOS) integrated circuit. The devices consist of a 10bit shift Register and 10bit Latches, and 10bit DMOS structures ...

Page 2

BLOCK DIAGRAM ABSOLUTE MAXIMUM RATINGS CHARACTERISTIC Supply Voltage Input Voltage Output Drain−Source Voltage Output Current P Power Dissipation F Operating Temperature Storage Temperature Note 1: Delated above 25°C in the proportion of 11 °C(P−type), 7 °C(F−type). ...

Page 3

RECOMMENDED OPERATING CONDITIONS CHARACTERISTIC Supply Voltage "H" Level Input Voltage "L" Level Output Drain−Source Voltage Output Current P Power Dissipation F Note 1: On Glass Epoxy (50 × 50 × 1 40%) ELECTRICAL CHARACTERISTICS CHARACTERISTIC "L" Level "L" ...

Page 4

SWITCHING CHARACTERISTICS (Ta = 25° OUT CHARACTERISTIC CLK− OUTn CLK− OUTn Propagation Delay Time (Low−to−High) LAT − OUTn EN− OUTn CLK− OUTn Propagation Delay LAT − OUTn Time (High−to−Low) EN− ...

Page 5

TIMING DIAGRAM 1. Input timing diagram 2. Propagation delay time 5 TB62702P/F 2006-06-14 ...

Page 6

PRECUATIONS for USING Utmost care is necessary in the design of the output line and GND (L−GND, P−GND) line since IC may destroyed due to short−circuit between outputs, air contamination fault, or fault by ...

Page 7

Package Dimensions Weight: 2.25 g (typ.) 7 TB62702P/F 2006-06-14 ...

Page 8

Package Dimensions Weight: 0.48 g (typ.) 8 TB62702P/F 2006-06-14 ...

Page 9

Notes on Contents 1. Block Diagrams Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. 2. Equivalent Circuits The equivalent circuit diagrams may be simplified or some parts of ...

Page 10

Points to Remember on Handling of ICs (1) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the ...

Page 11

RESTRICTIONS ON PRODUCT USE • The information contained herein is subject to change without notice. • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to ...

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