lm2755tmx National Semiconductor Corporation, lm2755tmx Datasheet - Page 4

• Manufacturer Part Number: lm2755tmx
• Description: Charge Pump Led Controller With I2c Compatible Interface In Micro Smd
• Manufacturer: National Semiconductor Corporation

www.national.com
t
t
t
t
t
1
2
3
4
5
Symbol
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation
of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions,
see the Electrical Characteristics tables.
Note 2: All voltages are with respect to the potential at the GND pin.
Note 3: Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at T
= 155°C (typ.).
Note 4: For detailed soldering specifications and information, please refer to National Semiconductor Application Note 1112: Micro SMD Wafer Level Chip Scale
Package (AN-1112).
.
Note 5: The human body model is a 100pF capacitor discharged through a 1.5kΩ resistor into each pin. (MIL-STD-883 3015.7)
Note 6: In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be
derated. Maximum ambient temperature (T
dissipation of the device in the application (P
following equation: T
Note 7: Junction-to-ambient thermal resistance is highly dependent on application and board layout. In applications where high maximum power dissipation
exists, special care must be paid to thermal dissipation issues in board design. For more information, please refer to National Semiconductor Application Note
1112: Micro SMD Wafer Level Chip Scale Package (AN-1112).
Note 8: Min and Max limits are guaranteed by design, test, or statistical analysis. Typical numbers are not guaranteed, but do represent the most likely norm.
Note 9: C
Note 10: For the current sinks on a part, the following are determined: the maximum sink current in the group (MAX), the minimum sink current in the group (MIN),
and the average sink current of the group (AVG). Two matching numbers are calculated: (MAX-AVG)/AVG and (AVG-MIN)/AVG. The larger number of the two
(worst case) is considered the matching figure. The typical specification provided is the most likely norm of the matching figure for all parts
Note 11: The maximum total output current for the LM2755 should be limited to 90mA. The total output current can be split among any of the three banks (I
I
current regulation. See the Maximum Output Current section of the datasheet for more information.
Note 12: For each I
requirement is not met, LED current regulation will be compromised.
Note 13: SCL and SDIO signals are referenced to VIO and GND for minimum VIO voltage testing.
Note 14: SCL and SDIO should be glitch-free in order for proper brightness control to be realized.
D2
= I
D3
= 30mA Max.). Under maximum output current conditions, special attention must be given to input voltage and LED forward voltage to ensure proper
SCL (Clock Period)
Data In Setup Time to SCL High
Data Out stable After SCL Low
SDIO Low Setup Time to SCL Low
(Start)
SDIO High Hold Time After SCL
High (Stop)
IN
, C
POUT
Dx
, C
A-MAX
output pin, headroom voltage is the voltage across the internal current sink connected to that pin. For V
1
, and C
Parameter
= T
J-MAX-OP
2
: Low-ESR Surface-Mount Ceramic Capacitors (MLCCs) used in setting electrical characteristics
– (θ
JA
A-MAX
× P
D-MAX
D-MAX
) is dependent on the maximum operating junction temperature (T
), and the junction-to ambient thermal resistance of the part/package in the application (θ
).
4
Condition
J-MAX-OP
20180905
Min
100
100
100
2.5
J
0
= 105°C), the maximum power
HR
= 160°C (typ.) and disengages at T
= V
OUT
Typ
-V
Dxx
. If headroom voltage
JA
), as given by the
Max
Units
D1
µs
ns
ns
ns
ns
=
J