tb6617fng TOSHIBA Semiconductor CORPORATION, tb6617fng Datasheet - Page 9

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tb6617fng

Manufacturer Part Number
tb6617fng
Description
H-bridge Driver Ic
Manufacturer
TOSHIBA Semiconductor CORPORATION
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
TB6617FNG
Manufacturer:
TOSHIBA/东芝
Quantity:
20 000
Notes on Contents
1. Block Diagrams
2. Equivalent Circuits
3. Timing Charts
4. Application Circuits
5. Test Circuits
IC Usage Considerations
[1] The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even
[2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over
[3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to
[4] Do not insert devices in the wrong orientation or incorrectly.
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for
explanatory purposes.
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory
purposes.
Timing charts may be simplified for explanatory purposes.
The application circuits shown in this document are provided for reference purposes only. Thorough evaluation
is required, especially at the mass production design stage.
Toshiba does not grant any license to any industrial property rights by providing these examples of application
circuits.
Components in the test circuits are used only to obtain and confirm the device characteristics. These components
and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment.
Notes on handling of ICs
for a moment. Do not exceed any of these ratings.
current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute
maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the
wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To
minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse
capacity, fusing time and insertion circuit location, are required.
prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON
or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause
injury, smoke or ignition.
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by
explosion or combustion.
Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the
protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition.
Make sure that the positive and negative terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the
rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or
combustion.
In addition, do not use any device that is applied the current with inserting in the wrong orientation or
incorrectly even just one time.
9
TB6617FNG
2011-02-10

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