tb7102af TOSHIBA Semiconductor CORPORATION, tb7102af Datasheet

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tb7102af

Manufacturer Part Number
tb7102af
Description
Buck Dc-dc Converter Ic
Manufacturer
TOSHIBA Semiconductor CORPORATION
Datasheet
Buck DC-DC Converter IC
TB7102AF contains high-speed and low-on-resistance power
MOSFETs for the main switch and synchronous rectifier to
achieve high efficiency.
Features
Part Marking
small overloads such as minor short-term overcurrent, or overheating. The protective functions do not necessarily
protect Product under all circumstances. When incorporating Product into your system, please design the system (1)
to avoid such overloads upon the Product, and (2) to shut down or otherwise relieve the Product of such overload
conditions immediately upon occurrence. For details, please refer to the notes appearing below in this document and
other documents referenced in this document.
The TB7102AF is a single-chip buck DC-DC converter IC. The
The product(s) in this document (“Product”) contain functions intended to protect the Product from temporary
Enables up to 1 A of load current (I
external components.
High efficiency (η = 95% typ.)
(@V
Operating voltage (V
A high 1-MHz oscillation frequency (typ.) allows the use of small external components.
Uses internal phase compensation to achieve high efficiency with a minimum of external components.
Allows the use of a small surface-mount ceramic capacitor as an output filter capacitor.
Enable threshold voltage : V
Housed in a small surface-mount package (PS-8) with low thermal resistance.
Undervoltage lockout (UVLO), thermal shutdown (TSD) and overcurrent protection (OCP)
This product has a MOS structure and is sensitive to electrostatic discharge.
*: The lot number consists of three digits. The first digit represents the last digit of the year of manufacture, and the
IN
following two digits indicates the week of manufacture between 01 and either 52 or 53.
= 5 V, V
The dot (•) on the top surface indicates pin 1.
7 1 0 2A
OUT
= 3.3 V and I
IN
*
) range: 2.7 V to 5.5 V
Toshiba BiCD Integrated Circuit Silicon Monolithic
IH(EN)
Part Number (Abbrev.)
OUT
Lot No.
OUT
= 1.5 V, V
= 300 mA)
TB7102AF
) with a minimum of
IL(EN)
Manufacturing week code
(The first week of the year is 01; the last week is 52 or 53.)
Manufacturing year code (last digit of the year of manufacture)
Pin Assignment
= 0.5 V(@V
1
IN
PGND
L
8
1
= 5 V)
X
Weight: 0.017 g (typ.)
V
V
7
2
FB
IN
N.C.
EN
6
3
Handle with care.
SGND
N.C.
5
4
TB7102AF
2008-05-22

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tb7102af Summary of contents

Page 1

... Toshiba BiCD Integrated Circuit Silicon Monolithic Buck DC-DC Converter IC The TB7102AF is a single-chip buck DC-DC converter IC. The TB7102AF contains high-speed and low-on-resistance power MOSFETs for the main switch and synchronous rectifier to achieve high efficiency. Features • Enables load current (I external components. ...

Page 2

... Ordering Information Part Number TB7102AF (TE85L, F) Embossed tape (3000 units per reel) Block Diagram Undervoltage EN lockout & soft-start reference voltage Oscillator Slope compensation Error amplifier 0.8 V (typ.) Pin Description Pin No. Symbol 1 PGND Ground for the output section Input pin ...

Page 3

... Timing Diagram Normal Operation OSC 0 I OUT 0 V OUT 0 V COMP OSC: Internal oscillator output signal I : Converter output current OUT V : Converter output voltage OUT V : Output voltage of error amplifier COMP I : Inductor current Switch pin voltage LX 3 TB7102AF 2008-05-22 ...

Page 4

... Thermal Resistance Characteristics Characteristics Thermal resistance, junction to ambient Note 1: Glass epoxy board Note 2: The TB7102AF may go into thermal shutdown at the rated maximum junction temperature. Thermal design is required to ensure that the rated maximum operating junction temperature, T (Ta = 25°C) Symbol Rating Unit − ...

Page 5

... Δ UVR IN EN Δ LIM IN 5 TB7102AF = 25°C and V = 2 Min Typ. Max ⎯ 2.7 5 ⎯ 0.68 0 2.7 V ⎯ 0.55 0. ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ...

Page 6

... R : Output voltage setting resistance = 2.4 kΩ FB2 Inductor = 3.3 μH (NP04SB3R3N from Taiyo Yuden Co., Ltd.) L: Component values need to be adjusted, depending on the TB7102AF’s input/output conditions and the board layout. Application Notes Inductor Selection The inductance required for inductor L can be calculated as follows: V − ...

Page 7

... ESR value, it helps reduce the output ripple voltage; however, because the ceramic capacitor provides less phase margin, it should be thoroughly evaluated. Component Values = 25°C) (@V IN These values are presented only as a guide. The following values may need tuning depending on the TB7102AF’s input/output conditions and the board layout. Output Voltage Inductance Setting V L OUT 3.3 μ ...

Page 8

... The TB7102AF provides thermal shutdown. When the junction temperature continues to rise and reaches T (160°C typ.), the TB7102AF goes into thermal shutdown and shuts off the power supply. TSD has a hysteresis of about 20°C. The device is enabled again when the junction temperature has dropped by approximately 20°C from the TSD trip point ...

Page 9

... The input voltage, output voltage, output current and temperature conditions should be considered when selecting capacitors, inductors and resistors. These components should be evaluated on an actual system prototype for best selection. • External components such as capacitors, inductor and resistors should be placed as close to the TB7102AF as possible. • The TB7102AF has an ESD diode between the EN and V V − ...

Page 10

... 5 IH(EN IL(EN 100 125 0 (° TB7102AF I – 100 125 Junction temperature, T (° – T IH(EN) IL(EN 2 IH(EN) V IL(EN) - ...

Page 11

... TB7102AF VUV, VUVR – Recovery voltage V UVR Detection voltage 100 125 Junction temperature, T (° – OUT = 1 25° Input voltage, V ...

Page 12

... Output current Input voltage TB7102AF f – T osc OUT = 1 100 125 (°C) j – I OUT OUT 3 OUT = 1 3.3 μH, C OUT = 22 μ 25°C 0.4 0.6 0.8 1 (A) OUT Δ ...

Page 13

... Output current, I Startup Characteristic OUT = 1 OUT = 3.3 μH, C OUT = 22 μ 25° TB7102AF η – I OUT OUT = 1 3.3 μH, C OUT = 22 μ 25°C 0.4 0.6 0.8 1 (A) OUT η – I OUT OUT = 3 3.3 μH C OUT = 10 μ ...

Page 14

... Board Layout Example Component side silk Component side pattern Solder side silk Solder side pattern 14 TB7102AF 2008-05-22 ...

Page 15

... Toshiba Corporation C1 Murata Manufacturing Co., Ltd. C2 Murata Manufacturing Co., Ltd. R1 KOA Corporation R2 KOA Corporation L1 Taiyo Yuden Co., Ltd. TP1 IC1 L1 8 PGND N.C. 5 SGND N.C. TP2 Vendor Part Number TB7102AF GRM21BB30J106K GRM21BB30J106K RK73H1ET RK73H1ET NP04SB3R3N 15 TB7102AF TP3 V OUT GND R2 2008-05-22 ...

Page 16

... Package Dimensions Weight: 0.017 g (typ.) 16 TB7102AF 2008-05-22 ...

Page 17

... Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 17 TB7102AF 20070701-EN GENERAL 2008-05-22 ...

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