ammc-6231 Avago Technologies, ammc-6231 Datasheet - Page 7

• Manufacturer Part Number: ammc-6231
• Description: 16?32 Ghz Low Noise Amplifer
• Manufacturer: Avago Technologies

Biasing and Operation
The AMMC-6231 is normally biased with a positive supply
connected to both V
100pF bypass capacitor as shown in Figure 21. The rec-
ommended supply voltage is 3 V. It is important to place
the bypass capacitor as close to the die as possible. No
negative gate bias voltage is needed for the AMMC-6231.
Input and output matching are achieved on-die, there-
fore no other external component is required besides
one 100pF bypass capacitor for the main supply. The
input and output are DC-blocked with internal coupling
capacitors.
No ground wires are needed because all ground connec-
tions are made with plated through-holes to the backside
of the device.
Refer the Absolute Maximum Ratings table for allowed
DC and thermal conditions.
Assembly Techniques
The backside of the MMIC chip is RF ground. For microstrip
applications the chip should be attached directly to the
ground plane (e.g. circuit carrier or heatsink) using electrically
conductive epoxy
For best performance, the topside of the MMIC should be
brought up to the same height as the circuit surrounding
it. This can be accomplished by mounting a gold plate
metal shim (same length and width as the MMIC) under
the chip which is of correct thickness to make the chip
and adjacent circuit the same height. The amount of
epoxy used for the chip and/or shim attachment should
be just enough to provide a thin fillet around the bottom
perimeter of the chip or shim. The ground plan should
be free of any residue that may jeopardize electrical or
mechanical attachment.
RFin
Figure 17. AMMC-6231 Simplified Schematic
7
[1,2]
D1
and V
D2
bond pads through the
VD1
The location of the RF bond pads is shown in Figure
12. Note that all the RF input and output ports are in a
Ground-Signal-Ground configuration.
RF connections should be kept as short as reasonable to
minimize performance degradation due to undesirable
series inductance. A single bond wire is normally suf-
ficient for signal connections, however double bonding
with 0.7 mil gold wire or use of gold mesh is recom-
mended for best performance, especially near the high
end of the frequency band.
Thermosonic wedge bonding is preferred method for
wire attachment to the bond pads. Gold mesh can be at-
tached using a 2 mil round tracking tool and a tool force
of approximately 22 grams and a ultrasonic power of
roughly 55 dB for a duration of 76 +/- 8 mS. The guided
wedge at an untrasonic power level of 64 dB can be used
for 0.7 mil wire. The recommended wire bond stage tem-
perature is 150 +/- 2C.
Caution should be taken to not exceed the Absolute
Maximum Rating for assembly temperature and time.
The chip is 100um thick and should be handled with care.
This MMIC has exposed air bridges on the top surface and
should be handled by the edges or with a custom collet
(do not pick up the die with a vacuum on die center).
This MMIC is also static sensitive and ESD precautions
should be taken
Notes:
1. Ablebond 84-1 LM1 silver epoxy is recommended.
2. Eutectic attach is not recommended and may jeopardize reliability of
the device.
VD2
RFout