89hpes32h8 Integrated Device Technology, 89hpes32h8 Datasheet - Page 16

• Manufacturer Part Number: 89hpes32h8
• Description: 32-lane, 8-port Pcie System Interconnect Switch
• Manufacturer: Integrated Device Technology

Thermal Considerations
Recommended Operating Temperature
Power Consumption
(and also listed below).
Table 13 (and also listed below).
that is relevant to the thermal performance of the PES32H8 switch.
IDT 89HPES32H8 Data Sheet
Typical power is measured under the following conditions: 25°C Ambient, 35% total link usage on all ports, typical voltages defined in Table 13
Maximum power is measured under the following conditions: 70°C Ambient, 85% total link usage on all ports, maximum voltages defined in
This section describes thermal considerations for the PES32H8 (31mm
Number of active
Lanes per Port
8/8/8/8
θ
Symbol
JA(effective)
T
T
A(max)
J(max)
θ
θ
P
JB
JC
Watts
mA
Effective Thermal Resistance, Junction-to-Ambient
1.0V
Core Supply
Typ
1800
1.81
Thermal Resistance, Junction-to-Board
Thermal Resistance, Junction-to-Case
Power Dissipation of the Device
Table 16 Thermal Specifications for PES32H8, 31x31mm FCBGA900 Package
Junction Temperature
Ambient Temperature
1.1V
Max
2100
2.31
Commercial
Parameter
Industrial
Grade
1.0V
PCIe Digital
Typ
1677
1.68
Table 14 PES32H8 Operating Temperatures
Supply
Table 15 PES32H8 Power Consumption
1.1V
Max
1990
2.19
16 of 40
1.0V
PCIe Analog
Typ
0.79
792
Supply
2
FCBGA900 package). The data in Table 16 below contains information
Value
12.8
6.81
1.1V
125
Max
6.6
5.6
2.3
0.1
70
909
1.0
1.5V
PCIe Termin-
Typ
-40
1.21
ation Supply
804
0
°
Temperature
Units
°
C to +70
Watts
o
o
o
o
o
C to +85
C/W
C/W
C/W
C/W
C/W
o
o
C
C
1.575V
Max
°
826
1.3
°
C Ambient
C Ambient
3.3V
0.003
Typ
I/O Supply
1
Conditions
1 m/S air flow
2 m/S air flow
Zero air flow
Maximum
Maximum
Maximum
3.6V
Max
0.01
2
Power
5.5W
April 16, 2008
Typ
Total
W
Power
Max
6.81