upa1710 Renesas Electronics Corporation., upa1710 Datasheet

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upa1710

Manufacturer Part Number
upa1710
Description
Switching P-channel Power Mos Fft Industrial Use
Manufacturer
Renesas Electronics Corporation.
Datasheet

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Document No. G10888EJ2V0DS00 (2nd edition)
Date Published April 1996 P
Printed in Japan
DESCRIPTION
designed for DC/DC converter and power management
applications of notebook computers.
FEATURES
• Low On-Resistance
• Low C
• Built-in G-S Protection Diode
• Small and Surface Mount Package
ABSOLUTE MAXIMUM RATINGS (T
device actually used, an additional protection circuit is externally required if voltage exceeding the rated voltage may
be applied to this device.
This product is P-Channel MOS Field Effect Transistor
R
R
(Power SOP8)
Drain to Source Voltage
Gate to Source Voltage
Drain Current (DC)
Drain Current (pulse)*
Total Power Dissipation (T
Channel Temperature
Storage Temperature
* PW 10 s, Duty Cycle
** Mounted on ceramic substrate of 1200 mm
The diode connected between the gate and source of the transistor serves as a protector against ESD. When this
DS(on)1
DS(on)2
iss
= 70 m
= 0.16
C
iss
= 980pF Typ.
Max.(V
Max.(V
The information in this document is subject to change without notice.
GS
GS
A
= –10V, I
= –4V, I
1%
= 25 C)** P
P-CHANNEL POWER MOS FFT
D
D
= –2.0A)
= –2.5A)
V
V
I
I
T
T
D(DC)
D(pulse)
DATA SHEET
DSS
GSS
T
ch
stg
INDUSTRIAL USE
A
= 25 ˚C, All terminals are connected)
SWITCHING
2
–50 to +150
0.7 mm
+
MOS Field Effect Power Transistors
+
+
–30
150
5.0
2.0
20
20
˚ C
˚ C
W
V
V
A
A
1
8
5.37 Max
0.40
1.27
PACKAGE DIMENSIONS
+0.10
–0.05
Gate Protection
Diode
Gate
4
5
0.78Max
(in millimeter)
0.12 M
Source
Drain
1,2,3
4
5,6,7,8 ; Drain
PA1710
0.5±0.2
6.0±0.3
Body
Diode
4.4
; Source
; Gate
©
0.8
0.10
1995

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upa1710 Summary of contents

Page 1

DESCRIPTION This product is P-Channel MOS Field Effect Transistor designed for DC/DC converter and power management applications of notebook computers. FEATURES • Low On-Resistance Max.(V DS(on 0.16 Max.(V DS(on)2 GS • Low C ...

Page 2

ELECTRICAL CHARACTERISTICS (T CHARACTERISTICS Drain to Source On-state Resistance Gate to Source Cutoff Voltage Forward Transfer Admittance Drain Leakage Current Gate to Source Leakage Current Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-On Delay Time Rise Time Turn-Off Delay Time ...

Page 3

DERATING FACTOR OF FORWARD BIAS SAFE OPERATING AREA 100 100 120 140 160 T - Ambient Temperature - °C a FORWARD BIAS SAFE OPERATING AREA -100 Mounted on ceramic substrate of ...

Page 4

TRANSIENT THERMAL RESISTANCE vs. PULSE WIDTH 1 000 100 10 1 0.1 0.01 0.001 10 100 FORWARD TRANSFER ADMITTANCE vs. DRAIN CURRENT 100 V Pulsed T = -25 ° °C 75 °C 10 125 °C 1 0.1 -0.1 ...

Page 5

DRAIN TO SOURCE ON-STATE RESISTANCE vs. CHANNEL TEMPERATURE 180 140 100 Pulsed I = ...

Page 6

REFERENCE Document Name NEC semiconductor device reliability/quality control system Quality grade on NEC semiconductor devices Semiconductor device mounting technology manual Semiconductor device package manual Guide to quality assurance for semiconductor devices Semiconductor selection guide Power MOS FET features and application ...

Page 7

PA1710 7 ...

Page 8

No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC ...

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