upg101p Renesas Electronics Corporation., upg101p Datasheet

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upg101p

Manufacturer Part Number
upg101p
Description
Wide Band Amplifier Chips
Manufacturer
Renesas Electronics Corporation.
Datasheet
Document No. P12402EJ2V0DS00 (2nd edition)
(Previous No. IC-3144)
Date Published February 1997 N
Printed in Japan
DESCRIPTION
available in chip form.
frequency band. These devices are most suitable for the IF stage of microwave communication system and the
measurement equipment.
FEATURES
• Wide band : f = 50 MHz to 3 GHz
ORDERING INFORMATION
ABSOLUTE MAXIMUM RATINGS (T
Drain Voltage
Gate Voltage
Input Voltage
Input Power
Total Power Dissipation
Operating Temperature
Storage Temperature
P PG100P and P PG101P are GaAs integrated circuits designed as wide band amplifiers. Both devices are
P PG100P is low noise amplifier from 50 MHz to 3 GHz and P PG101P is a medium power amplifier in the same
*1 Mounted with AuSn hard solder
*2 The temperature of base material baside the chip
PART NUMBER
P PG100P
P PG101P
WIDE BAND AMPLIFIER CHIPS
FORM
chip
chip
V
V
V
P
P
T
T
opr
stg
DD
GG
in
in
tot
*1
*2
DATA SHEET
DATA SHEET
A
P P P P PG100P, P P P P PG101P
= 25 °C)
ð65 to +125
ð65 to +175
ð3 to +0.6
P PG100P
+15
1.5
+8
ð8
GaAs INTEGRATED CIRCUIT
ð65 to +125
ð65 to +175
ð5 to +0.6
P PG101P
+15
+10
1.5
ð8
dBm
°C
°C
W
V
V
V
©
1992

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upg101p Summary of contents

Page 1

DESCRIPTION P PG100P and P PG101P are GaAs integrated circuits designed as wide band amplifiers. Both devices are available in chip form. P PG100P is low noise amplifier from 50 MHz to 3 GHz and P PG101P is a medium ...

Page 2

ELECTRICAL CHARACTERISTICS (T P PG100P ( ð CHARACTERISTICS SYMBOL Drain Current I DD Gate Current I GG Power Gain Gp Gain Flatness ' Gp Noise Figure NF Input Return Loss RL in ...

Page 3

Fig Pin Ceramic Package 1.27 0.1 1.27 0.1 4–0.6 4–0 3.8 0.2 10.6 MAX PG100P PG101P 1 1.7 MAX. +0.05 0.2 –0.02 3 ...

Page 4

TYPICAL CHARACTERISTICS P PG100P ( ð POWER GAIN AND NOISE FIGURE vs. FREQUENCY T = – ...

Page 5

P PG101P ( ð POWER GAIN AND NOISE FIGURE vs. FREQUENCY – ...

Page 6

CHIP DIMENSIONS (Unit : mm) P PG100P PG101P 1.3 Bonding Pad Size: 100 1.3 Bonding Pad Size: ...

Page 7

RECOMMENDED CHIP ASSEMBLY CONDITIONS Die Attachment Atmosphere : N gas 2 Temperature : 320 r5 °C AuSn Preform : 0.5 u 0.5 u 0.05 * The hard solder such as AuSi or AuGe which has higher melting point than AuSn ...

Page 8

No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC ...

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