cxm3531xr Sony Electronics, cxm3531xr Datasheet

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cxm3531xr

Manufacturer Part Number
cxm3531xr
Description
Sp4t Antenna Switch For Cdma/umts
Manufacturer
Sony Electronics
Datasheet
SP4T Antenna Switch for CDMA/UMTS
Description
Features
Package
Structure
The CXM3531XR is a high power SP4T antenna switch for CDMA/UMTS applications.
The antenna port can be routed to either of the 4TRx ports.
The low insertion loss on transmit means increased talk time as the Tx power amplifier can be operated at a
lower output level.
Built-in decoder reduces component count and simplifies PCB layout by allowing direct connection of the
switch to digital base band control lines with the 1.8V CMOS logic levels.
The Sony GaAs JPHEMT MMIC Process is used for low insertion loss and high linearity.
(Applications: CDMA/UMTS handsets)
Small package: 20pin XQFN (2.7mm × 2.7mm × 0.35mm Typ.)
GaAs JPHEMT MMIC
This IC is ESD sensitive device. Special handling precautions are required.
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license
by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating
the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
Low insertion Loss (Tx): 0.28dB (Typ.) @27dBm (450MHz)
High linearity: IIP3 = 70dBm
No DC Blocking Capacitors required on RF ports.
Lead-Free and RoHS Compliant
0.30dB (Typ.) @27dBm (Cellular)
0.36dB (Typ.) @27dBm (PCS)
0.38dB (Typ.) @27dBm (IMT2000)
0.45dB (Typ.) @27dBm (2.6GHz)
- 1 -
CXM3531XR
E08909-PS

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cxm3531xr Summary of contents

Page 1

... SP4T Antenna Switch for CDMA/UMTS Description The CXM3531XR is a high power SP4T antenna switch for CDMA/UMTS applications. The antenna port can be routed to either of the 4TRx ports. The low insertion loss on transmit means increased talk time as the Tx power amplifier can be operated at a lower output level. ...

Page 2

Absolute Maximum Ratings Bias voltage Control voltage Input power Max. [Ant, RF1, RF2, RF3, RF4] Operating temperature Storage temperature Maximum power dissipation 25mm × 25mm × t:0.8mm *1 ° ( ° Vctl 4V (Ta ...

Page 3

Block Diagram Pin Configuration V GND CTLA CTLB GND Ant XQFN-20P PKG (2.7mm × 2.7mm × 0.35mm Typ Top View ...

Page 4

Truth Table ON Path CTLA CTLB ANT – RF1 L ANT – RF2 H ANT – RF3 L ANT – RF4 H DC Bias Condition ° ( Item Min. Vctl (H) 1.3 Vctl ( 2.5 ...

Page 5

Electrical Characteristics Electrical Characteristics 1 ° ( 2.8V, Vctl = 0/1.8V) DD Item Symbol Insertion Loss IL Isolation ISO. Electrical Characteristics are measured with all RF ports terminated in 50Ω. *1 freq = 410 to ...

Page 6

Electrical Characteristics 2 ° ( 2.8V, Vctl = 0/1.8V) DD Item Symbol VSWR VSWR 2fo 3fo 2fo 3fo 2fo Harmonics 3fo 2fo 3fo 2fo 3fo P compression 0.2dB P 0.2dB input power Inter modulation IMD2 ...

Page 7

Electrical Characteristics 3 ° ( 2.8V, Vctl = 0/1.8V) DD Item Symbol Path Triple beat TBR ratio ANT- RF1, RF2, RF3, RF4 Electrical Characteristics are measured with all RF ports terminated in 50Ω. Measured with ...

Page 8

Recommended Circuit V DD GND CTLA CTLB GND Note blocking capacitors are required on all RF ports levels of all RF ports are GND (27nH) and C1 (12pF) are recommended on Ant port ...

Page 9

PCB Layout Template XQFN-20P-01 Macro (Reference) 2.7mm × t0.35mm PKG size: Terminal pitch: 0.4mm Terminal length: 0.4mm Mask thickness: 0.11mm : Land area : Mask open area (Solder printing area) : Board resist open area : Metal area in board ...

Page 10

Package Outline (Unit: mm) LEAD PLATING SPECIFICATIONS ITEM LEAD MATERIAL SOLDER COMPOSITION PLATING THICKNESS - 10 - SPEC. COPPER ALLOY Sn-Bi Bi:1-4wt% 5-18µm Sony Corporation ...

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