2016L150 LITTELFUSE [Littelfuse], 2016L150 Datasheet - Page 58

• Manufacturer Part Number: 2016L150
• Manufacturer: LITTELFUSE [Littelfuse]

• R ecommendedreflowmethods:IR,vaporphaseoven,hot
• D evicesarenotdesignedtobewavesolderedtothe
• D evicescanbecleanedusingstandardindustrymethods
Note: I freflowtemperaturesexceedtherecommended
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Soldering Parameters - Solder Reflow
Condition
Peak Temp/ Duration Time
> 220°C
Preheat 160°C~ 190°C
Storage Condition
Physical Specifications
Lead Material
Soldering
Characteristics
Insulating Material
Device Labeling
airoven,N
bottomsideoftheboard.
andsolvents.
profile,devicesmaynotmeettheperformance
requirements.
2
environmentforlead-free.
Tin-platedcopper
SolderabilityperMIL-STD-202,
Method208E
Cured,flameretardantepoxypolymer
meetsUL94V-0requirements.
MarkedwithLF,voltage,currentrating,
anddatecode.
Reflow
260°C > 5Sec
30Sec~60Sec
60Sec~90Sec
0°C~35°C, < 70%RH
POLYFUSE
Radial Leaded
Electronics Designers Guide
®
Resettable PTCs
5
Operating/Storage
Temperature
Maximum Device Surface
Temperature in Tripped State
Passive Aging
Humidity Aging
Thermal Shock
Solvent Resistance
Environmental Specifications
260
220
190
160
0
Preheating
60 to 90
Soldering
30 to 60
Time(s)
Specifications are subject to change without notice.
-40°Cto+85°C
125°C
85°C/85°C,1000hours
+85°C,85%R.H.1000hours
MIL-STD-202FMethod107G
+125°Cto-55°C10times
MIL-STD-202,Method215F
120
Cooling
00R Series