CE71J7 FUJITSU [Fujitsu Component Limited.], CE71J7 Datasheet

CE71J7

Manufacturer Part Number

CE71J7

Description

0.25um CMOS Technology

Manufacturer

FUJITSU [Fujitsu Component Limited.]

Datasheet

1.CE71J7.pdf (4 pages)

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CE71 Series Embedded Array

0.25µm CMOS Technology

Features

Description

Fujitsu’s CE71 is a series of high-performance, 0.18µm L

CMOS embedded arrays that include full support of diffused

high-speed RAMs, ROMs, mixed-signal macros, and a

variety of other embedded functions.

The CE71 series offers density and performance similar to

those of standard cells, yet provides the time-to-market

advantage of gate arrays. The CE71 series devices include

44µm, 66µm, or 88µm pad pitch for a cost-effective

solution for both pad-limited and core-limited designs.

With a nominal 1.5V to 2.5V core operation and with 2.5V

and 3.3V/5V tolerant I/Os, the CE71 series features a very

low-power consumption of 0.06µW/gate/MHz. Potential

applications for the CE71 series include computing, graphics,

communications, networking, wireless, and consumer designs.

• 0.18µm L

• Propagation delay of 61 ps

• Separate core and I/O supply voltages

• Mixed-signal macros–A/D and D/A converters

• I/Os: 2.5V, 3.3V, 5V tolerant

• Core power supply voltage: 2.5V, 1.8V, 1.5V

• Junction temperature: -40ºC~125ºC

• High performance and special I/Os–PCML, LVDS, PCI,

• Analog and digital PLLs

• Packaging options: QFP, HQFP, BGA, TBGA

• Support for major third-party EDA tools

SSTL, GTL+, AGP, USB

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(0.24µm drawn)

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CE71J1

CE71J2

CE71J3

CE71J4

CE71J5

CE71J6

CE71J7

CE71J8

CE71J9

CE71JA

CE71JB

CE71JC

CE71JD

CE71JE

CE71JF

CE71JG

CE71K1

CE71K2

CE71K3

CE71K4

CE71K5

CE71K6

CE71K7

CE71K8

Frame

Clk

J-Series with 66µm Stagger Pad Pitch and Wire Bonding

K-Series with 88µm Inline Pad Pitch and Wire Bonding

Soft Macro

Layout

Embedded

Fixed

Macro

Hard

Total Gates

1,098K

1,302K

1,524K

2.020K

2,586K

3,055K

3,564K

4,113K

5,114K

6,698K

8,096K

1,110K

1,559K

Clock Tree

216K

312K

488K

703K

911K

167K

237K

348K

524K

734K

963K

Soft Macro

Layout

Fixed

Total Pads

1,008

192

224

272

320

360

392

424

456

520

584

632

680

728

808

920

100

120

144

176

208

240

256

304

5V Tol.

PCML

PCI

Signals

152

178

206

264

304

360

472

506

102

126

152

178

206

220

264

Related parts for CE71J7

CE71J7 Summary of contents

Page 1

... J-Series with 66µm Stagger Pad Pitch and Wire Bonding Frame Total Gates CE71J1 216K CE71J2 312K CE71J3 488K CE71J4 703K CE71J5 911K CE71J6 1,098K CE71J7 1,302K CE71J8 1,524K CE71J9 2.020K CE71JA 2,586K CE71JB 3,055K CE71JC 3,564K CE71JD 4,113K CE71JE 5,114K ...

Page 2

CE71 Series Embedded Array L-Series with 44µm Inline Pad Pitch and Au Bump Frame Total Gates Total Pads CE71L4 356K 304 CE71L5 476K 352 CE71L6 677K 420 CE71L7 1,034K 520 CE71L8 1,469K 620 CE71L9 1,976K 720 CE71LA 2,513K 812 CE71LB ...

Page 3

PACKAGE AVAILABILITY No. of Pins Frame Size Thin and Low Profile QFP Packages (0.4, 0.5 mm lead pitch) 100 K1, K2 120 K2, K3 144 K3, K4, K8, T2, T3 176 K4, K5, T3, T4 208 T4, T5, T6, T7, ...

Page 4

FUJITSU MICROELECTRONICS AMERICA, INC. Corporate Headquarters 1250 East Arques Avenue, Sunnyvale, California 94088-3470 Tel: (800) 866-8608 Fax: (408) 737-5999 E-mail: inquiry@fma.fujitsu.com Web Site: http://www.fma.fujitsu.com © 1999 Fujitsu Microelectronics, Inc. All company and product names are trademarks or registered trademarks of ...

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