MB1608 ABC [ABC Taiwan Electronics Corp], MB1608 Datasheet

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MB1608

Manufacturer Part Number
MB1608
Description
HIGH CURRENT MULTILAYER CHIP BEAD
Manufacturer
ABC [ABC Taiwan Electronics Corp]
Datasheet

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Part Number
Manufacturer
Quantity
Price
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MB1608300YLB
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REF :
AR-001A
PROD.
NAME
Ⅰ﹒CONFIGURATION & DIMENSIONS:
Ⅱ﹒SCHEMATIC DIAGRAM:
Ⅲ﹒MATERIALS:
Ⅳ﹒GENERAL SPECIFICATION:
a﹒Body:Ferrite
b﹒Internal conductor:Silver or Ag / Pd
c﹒Terminal:Ag/Ni/Sn
d﹒Remark:Products comply with RoHS'
a﹒Storage temp.:-40℃ ---- +105℃
b﹒Operating temp.:-55℃ ---- +125℃
c﹒Terminal strength:
d﹒Solderability:
20090527-A
MB4532
MB4516
MB3261
MB2029
MB1608
Type
MB4532
MB4516
MB3261
MB2029
MB1608
Series
HIGH CURRENT MULTILAYER
D
requirements
SPECIFICATION FOR APPROVAL
F ( kgf )
Solder : Sn96.5 / Ag3 / Cu0.5
Solder temp. : 260±5℃
Flux : Rosin
Dip time : 4±1 seconds
CHIP BEAD
A
1.5
1.0
1.0
0.6
0.5
4.5±0.2
4.5±0.2
3.2±0.2
2.0±0.2
1.6±0.2
A
D
or equivalent
F
Time ( sec )
30±5
3.2±0.2
1.6±0.2
1.6±0.2
1.2±0.2
0.8±0.2
B
B
1.5±0.2
1.6±0.2
1.1±0.2
0.9±0.2
0.8±0.2
ABC'S ITEM NO.
ABC'S DWG NO.
C
Peak Temp:260℃ max.
Max time above 230℃ :50sec max.
Max time above 200℃ :70sec max.
250
200
150
100
50
0
+4.0
Temperature
Rising Area
/ sec max.
0.6±0.4
0.6±0.4
0.6±0.4
0.5±0.3
0.3±0.2
50
D
150 ~ 200
Preheat Area
100
/ 60 ~ 120 sec
I
MB□□□□□□□□L□-□□□
Time ( seconds )
3.0
3.0
2.2
1.0
0.7
( PCB Pattern )
G
a
G
150
Reflow Area
+2.0 ~ 4.0 ℃
/ sec max.
b
70sec max.
H
3.0
1.4
1.4
1.0
0.7
50sec max.
I
c
-(1.0 ~ 5.0)
200
Forced Cooling Area
Peak Temperature:
260
Unit : m/m
/ sec max.
PAGE: 1
1.5
1.5
1.1
1.0
0.7
230
I
250

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MB1608 Summary of contents

Page 1

... Type F ( kgf ) MB4532 1.5 MB4516 1.0 MB3261 1.0 MB2029 0.6 MB1608 0.5 d﹒Solderability: Solder : Sn96.5 / Ag3 / Cu0.5 or equivalent Solder temp. : 260±5℃ Flux : Rosin Dip time : 4±1 seconds AR-001A ABC'S DWG NO. ABC'S ITEM NO ...

Page 2

SPECIFICATION FOR APPROVAL REF : 20090527-A PROD. HIGH CURRENT MULTILAYER CHIP BEAD NAME Ⅴ﹒ELECTRICAL CHARACTERISTICS: DWG No. MB4532700YL□ -□□□ MB4532121YL□ -□□□ MB4532131YL□ -□□□ MB4516600YL□ -□□□ MB4516750YL□ -□□□ MB4516800YL□ -□□□ 1). □:Paclaging Information… A:Bulk □ □ □ 2)."- ":Reference code MB4532700YL□ ...

Page 3

... MB□□□□□□□□L□-□□□ ABC'S ITEM NO. Impedance RDC (Ω) (mΩ) at 100MHz max. 19±25% 40 26±25% 40 31±25% 40 50±25% 25 80±25% 30 7±25% 30 10±25% 30 30±25% 25 30±25% 60 MB3261260YL□ MB3261310YL□ MB3261800YL□ MB2029070YL□ MB2029300YL□ MB1608300YL□ PAGE: 2-2 IDC (A) max. 3.0 3.0 3.0 3.0 3.0 3.0 3.0 3.0 1.0 ...

Page 4

... Dimensions Style 178 178 ( 3 ) Q'TY & G.W. Per package Series Q'TY (pcs) MB4532 1,000 MB4516 2,000 MB3261 3,000 MB2029 4,000 MB1608 4,000 AR-001A ABC'S DWG NO. ABC'S ITEM NO ※ P:4 m/m 4 m/m Components User direction of feed 21±0 21±0 Inner : Reel G ...

Page 5

... HIGH CURRENT MULTILAYER CHIP BEAD NAME ( 4 ) TYPE DIMENSIONS Fig 1. (0.004) Fig 2. (0.004) Type MB4532 MB4516 MB3261 MB2029 MB1608 AR-001A ABC'S DWG NO. ABC'S ITEM NO. φ1.55±0.05 4±0.1 2±0.05 (0.157 ±0.004) (0.079 ±0.002) (0.061 ±0.002) P±0.1 A±0.1 (0.004) φ1.55±0.05 4± ...

Page 6

... MB□□□□□□□□L□-□□□ Reference code Appendix code 2 : Package Appendix code 1 : Classification Tolerance code Electrical code Dimension code Type code Remark T.B.D. 1000 pcs MB4532 2000 pcs MB4516 3000 pcs MB3261 4000 pcs MB2029 4000 pcs MB1608 ...

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