MC74HC00ANG ON Semiconductor, MC74HC00ANG Datasheet
MC74HC00ANG
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MC74HC00ANG Summary of contents
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MC74HC00A Quad 2−Input NAND Gate High−Performance Silicon−Gate CMOS The MC74HC00A is identical in pinout to the LS00. The device inputs are compatible with Standard CMOS outputs; with pullup resistors, they are compatible with LSTTL outputs. Features • Output Drive Capability: ...
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... Plastic DIP: – 10 mW/_C from 65_ to 125_C SOIC Package: – 7 mW/_C from 65_ to 125_C TSSOP Package: − 6.1 mW/_C from 65_ to 125_C For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor High−Speed CMOS Data Book (DL129/D). RECOMMENDED OPERATING CONDITIONS Î Î Î Î ...
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... ORDERING INFORMATION Device MC74HC00AN MC74HC00ANG MC74HC00AD MC74HC00ADG MC74HC00ADR2 MC74HC00ADR2G MC74HC00ADTR2 MC74HC00ADTR2G MC74HC00AF MC74HC00AFG MC74HC00AFEL MC74HC00AFELG †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb−Free. ...
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... Maximum Low−Level Output OL Voltage I Maximum Input Leakage in Current I Maximum Quiescent Supply CC Current (per Package) NOTE: Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor High−Speed CMOS Data Book (DL129/D). AC CHARACTERISTICS ( pF, Input t L Symbol Parameter t , Maximum Propagation Delay, Input Output Y ...
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−T− SEATING PLANE 0.13 (0.005) PACKAGE DIMENSIONS PDIP−14 CASE 646−06 ISSUE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, ...
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... G −T− SEATING 14 PL PLANE 0.25 (0.010 14X 0.58 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PACKAGE DIMENSIONS SOIC−14 CASE 751A−03 ISSUE 0.25 (0.010 ...