B384F120T30_10 VICOR [Vicor Corporation], B384F120T30_10 Datasheet

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B384F120T30_10

Manufacturer Part Number
B384F120T30_10
Description
Bus Converter
Manufacturer
VICOR [Vicor Corporation]
Datasheet
BCM
Bus Converter
• 384 V to 12 V V•I Chip
• 300 Watt (450 Watt for 1 ms)
• High density – up to 1017 W/in
• Small footprint – 260 W/in
• Low weight – 0.5 oz (15 g)
• ZVS / ZCS isolated sine
Product Description
The V•I Chip bus converter is a high efficiency (>95%),
narrow input range Sine Amplitude Converter
operating from a 360 to 400 Vdc primary bus to deliver
an isolated low voltage secondary (ELV).
The off-line BCM provides an isolated 11.3 -12.5 V
distribution bus and is ideal for use in silver boxes and
PFC front ends. Due to the fast response time and low
noise of the BCM, the need for limited life aluminum
electrolytic or tantalum capacitors at the input of POL
converters is reduced—or eliminated—resulting in
savings of board area, materials and total system cost.
The BCM achieves a power density of 1017 W/in
a V•I Chip package compatible with standard pick-and-
place and surface mount assembly processes. The
V•I Chip package provides flexible thermal management
through its low junction-to-case and junction-to-board
thermal resistance. Owing to its high conversion
efficiency and safe operating temperature range, the
BCM does not require a discrete heat sink in typical
applications. Low junction-to-case and junction-to-lead
thermal impedances assure low junction temperatures
and long life in the harshest environments.
amplitude converter
TM
TM
Converter
vicorpower.com
2
3
• Typical efficiency 95%
• 125°C operation (T
• <1 µs transient response
• >3.5 million hours MTBF
• No output filtering required
TM
(SAC
3
in
800-735-6200
TM
)
Absolute Maximum Ratings
Part Numbering
Note:
(1) The referenced junction is defined as the semiconductor having the highest temperature.
+In to -In
PC to -In
+Out to -Out
Isolation voltage
Output current
Peak output current
Output power
Peak output power
Case temperature
Operating junction temperature
Storage temperature
Parameter
This temperature is monitored by a shutdown comparator.
Bus Converter
J
)
Module
B
V•I Chip Bus Converter
Input Voltage
384
Designator
Vin = 360 - 400 V
Vout = 11.3 - 12.5 V
Iout = 25 A
K = 1/32
Rout = 20.0 mΩ max
T = Through hole
(1)
Configuration
F = J-lead
-0.5 to 16.0
-1.0 to 440
-0.3 to 7.0
-40 to 125
-40 to 125
F
Values
4242
27.7
37.5
300
450
225
245
500
B384F120T30
Output Voltage
©
120
(=V
Designator
OUT
Grade
Product Grade Temperatures (°C)
x10)
T
Unit
Vdc
Vdc
Vdc
Vdc
Vdc
°C
°C
°C
°C
W
W
A
A
B384F120T30
-40 to125
Storage Operating (T
T
Notes
For 100 ms
Input to Output
Continuous
For 1 ms
Continuous
For 1 ms
MSL 5
MSL 6
T-Grade
T-Grade
-40 to125
Output Power
Designator
(=P
30
Page 1 of 12
OUT
J
)
/10)
Rev. 2.4

Related parts for B384F120T30_10

B384F120T30_10 Summary of contents

Page 1

BCM TM Bus Converter TM • 384 V•I Chip Converter • 300 Watt (450 Watt for 1 ms) • High density – 1017 W/in 3 • Small footprint – 260 W/in 2 • Low ...

Page 2

Specifications Input (Conditions are at 384 Vin, full load, and 25°C ambient unless otherwise specified) Parameter Input voltage range Input dV/dt Input undervoltage turn-on Input undervoltage turn-off Input overvoltage turn-on Input overvoltage turn-off Input quiescent current Inrush current overshoot Input ...

Page 3

Specifications (continued) Output (Conditions are at 384 Vin, full load, and 25°C ambient unless otherwise specified) Parameter Output voltage Output power Rated DC current Peak repetitive power Current share accuracy Efficiency Half load Full load Internal output inductance Internal output ...

Page 4

Specifications (continued) Figure 7 — Output voltage ripple at full load and 384 Vin without any external bypass capacitor. Ripple vs. Output Power 200 180 160 140 120 100 120 150 Output Power ...

Page 5

Specifications (continued) General Parameter MTBF MIL-HDBK-217F Isolation specifications Voltage Capacitance Resistance Agency approvals Mechanical Weight Dimensions Length Width Height Thermal Over temperature shutdown Thermal capacity Junction-to-case thermal impedance (R Junction-to-board thermal impedance (R Auxiliary Pins (Conditions are at 48 Vin, ...

Page 6

Pin / Control Functions +In / -In – DC Voltage Input Ports The V•I Chip input voltage range should not be exceeded. An internal under / over voltage lockout-function prevents operation outside of the normal operating input range. The BCM ...

Page 7

Mechanical Drawings TOP VIEW ( COMPONENT SIDE ) Figure 15 — BCM J-Lead mechanical outline; Onboard mounting Figure 16 — BCM PCB land layout information vicorpower.com BOTTOM VIEW RECOMMENDED LAND PATTERN ( COMPONENT SIDE SH OWN ) 800-735-6200 V•I Chip ...

Page 8

Mechanical Drawings (continued) TOP VIEW ( COMPONENT SIDE ) Figure 17 — BCM through-hole mechanical outline NOTES: (mm) 1. DIMENSIONS ARE . inch 2. UNLESS OTHERWISE SPECIFIED TOLERANCES ARE: X.X [X.XX] = ±0.25 [0.01]; X.XX [X.XXX] = ±0.13 [0.005] 3. ...

Page 9

Configuration Options RECOMMENDED LAND PATTERN (NO GROUNDING CLIPS) RECOMMENDED LAND PATTERN (With GROUNDING CLIPS) TOP SIDE SHOWN Figure 19 — Hole location for push pin heat sink relative to V vicorpower.com TOP SIDE SHOWN I Chip • 800-735-6200 V•I Chip ...

Page 10

Behavioral & Test Circuits Input reflected ripple measurement point Fuse Enable/Disable Switch C1 R2 2.2 µF 2 kΩ electrolytic D1 SW1 Figure 20 — BCM test circuit V•I Chip Bus Converter Level 1 DC Behavioral Model for ...

Page 11

BCM Applications Parallel Operation The BCM will inherently current share when operated in an array. Arrays may be used for higher power or redundancy in an application. Current sharing accuracy is maximized when the source and load impedance presented to ...

Page 12

Warranty Vicor products are guaranteed for two years from date of shipment against defects in material or workmanship when in normal use and service. This warranty does not extend to products subjected to misuse, accident, or improper application or maintenance. ...

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