MC14011UBCPG ON Semiconductor, MC14011UBCPG Datasheet - Page 7

IC GATE NAND QUAD CMOS 14DIP

MC14011UBCPG

Manufacturer Part Number
MC14011UBCPG
Description
IC GATE NAND QUAD CMOS 14DIP
Manufacturer
ON Semiconductor
Series
4000Br
Datasheet

Specifications of MC14011UBCPG

Logic Type
NAND Gate
Number Of Inputs
2
Number Of Circuits
4
Current - Output High, Low
3.4mA, 3.4mA
Voltage - Supply
3 V ~ 18 V
Operating Temperature
-55°C ~ 125°C
Mounting Type
Through Hole
Package / Case
14-DIP (0.300", 7.62mm)
Output Current
8.8mA
No. Of Inputs
2
Supply Voltage Range
3V To 18V
Logic Case Style
DIP
No. Of Pins
14
Operating Temperature Range
-55°C To +125°C
Filter Terminals
DIP
Rohs Compliant
Yes
Family Type
4000 CMOS
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
MC14011UBCPGOS

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC14011UBCPG
Manufacturer:
ON/安森美
Quantity:
20 000
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SEATING
PLANE
−T−
ON Semiconductor and
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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14
1
G
−A−
D
14 PL
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
0.25 (0.010)
M
*For additional information on our Pb−Free strategy and soldering
8
7
0.58
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
−B−
14X
T
K
B
S
C
P
7 PL
A
SOLDERING FOOTPRINT*
S
0.25 (0.010)
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
USA/Canada
Phone: 421 33 790 2910
Phone: 81−3−5773−3850
R
1
http://onsemi.com
X 45
CASE 751A−03
_
M
SOIC−14
ISSUE J
M
7.04
7X
B
7
M
DIMENSIONS: MILLIMETERS
J
1.52
14X
F
PITCH
1.27
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
5. DIMENSION D DOES NOT INCLUDE
ANSI Y14.5M, 1982.
MOLD PROTRUSION.
PER SIDE.
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.127
(0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
DIM
G
M
A
B
C
D
F
J
K
P
R
MILLIMETERS
MIN
8.55
3.80
1.35
0.35
0.40
0.19
0.10
5.80
0.25
1.27 BSC
0
_
MAX
8.75
4.00
1.75
0.49
1.25
0.25
0.25
6.20
0.50
7
_
0.337
0.150
0.054
0.014
0.016
0.008
0.004
0.228
0.010
MIN
0.050 BSC
0
INCHES
MC14001UB/D
_
0.344
0.157
0.068
0.019
0.049
0.009
0.009
0.244
0.019
MAX
7
_

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