tcd1709d TOSHIBA Semiconductor CORPORATION, tcd1709d Datasheet
tcd1709d
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tcd1709d Summary of contents
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... TOSHIBA CCD Linear Image Sensor CCD (Charge Coupled Device) The TCD1709D is a high sensitive and low dark current 7500 pixels CCD image sensor. The sensor is designed for facsimile, imagescanner and OCR. The device contains a row of 7500 pixels photodiodes which provide a 24 lines/mm (600DPI) across a A3 size paper. The device is operated by 5-V (pulse), and 12-V power supply ...
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... 2A4 1A4 OS4 46 45 OS3 7500 2 TCD1709D 2002-11-14 ...
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... CCD analog shift register 4 Shift gate 2 Photo …. diode Shift gate 1 CCD analog shift register f2A1 f2A3 f1A3 3 TCD1709D Signal output 46 OS4 buffer 22 SH …. Signal OS3 output 45 buffer f2B RS CP ...
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... Z 0.2 o ¾ DR 2500 V 4 ¾ ¾ OSX OSY ¾ NDs 0 ´ 100 % maximum deviation from (lx/s) 4 TCD1709D Max Unit Note 18 V/(lx/ (Note (Note 8) ¾ V (Note 3) ¾ lx/s (Note (Note (Note 5) mW ¾ ¾ ¾ (Note 6) 7.5 ...
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... Note 8: PRNU (3) is defined as maximum voltage with next pixel, where measured (typ.) Note 9: DC differential error voltage is defined as follows: Definition of DC differential error voltage = | Maximum DC signal output voltage OSX V : Minimum DC signal output voltage OSY ) and the maximum value of the dark DRK V DRK DSNU í OSX OSY 5 TCD1709D 2002-11-14 ...
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... So we specify the random noise as follows Random noise = 2 Video output Video output 200 ns 200 ns pixel ( pixel å times larger than that measured relative TCD1709D s 2002-11-14 ...
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... V CP ¾ 11 Symbol Min Typ. ¾ ¾ ¾ (Note 11) CfA 200 ¾ CfB 20 ¾ ¾ ¾ TCD1709D Max Unit 5.5 V 0.5 5.5 V 0.5 5.5 V 0.5 5.5 V 0.5 5 Max Unit 25 MHz 25 MHz ¾ pF ¾ pF ¾ pF ¾ pF ¾ pF 2002-11-14 ...
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D26 D27 D27 D28 D29 D29 D30 D31 D31 D32 D33 D33 D34 D35 D35 D36 D37 D37 D38 D39 D39 D40 D41 D41 D42 D43 D43 D120 D121 D121 D122 ...
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... CP RS, CP period (Note 12) Note 12: RS and CP must be stopped during this period RS, CP, OS Timing t10 RS t16 CP t12 t11 OS1 OS2 OS3 OS4 Cross point GND 1.5 V (min) 1.5 V (min) 9 TCD1709D t15 t17 t13 t14 2002-11-14 ...
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... TCD1709D 2002-11-14 ...
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... Soldering by the solder flow method cannot be guaranteed because this method may have deleterious effects on prevention of window glass soiling and heat resistance. Using a soldering iron, complete soldering within ten seconds for lead temperatures 260°C, or within three seconds for lead temperatures 350°C. 11 TCD1709D 2002-11-14 ...
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... Package Dimensions Weight: 16.0 g (typ.) 12 TCD1709D Unit: mm 2002-11-14 ...
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... TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. · The information contained herein is subject to change without notice. 13 TCD1709D 000707EBA 2002-11-14 ...