tcd2558d TOSHIBA Semiconductor CORPORATION, tcd2558d Datasheet
tcd2558d
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tcd2558d Summary of contents
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... TOSHIBA CCD Linear Image Sensor CCD (charge coupled device) Preliminary The TCD2558D is a high sensitive and low dark current 5340 elements × 3 line CCD color image sensor which includes CCD drive circuit, clamp circuit. The sensor can be used for image scanner. The device contains a row of 5340 × ...
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... Shift pulse voltage Reset pulse voltage Clamp pulse voltage Power supply Operating temperature Storage temperature Note 1: All voltage are with respect to SS terminals (ground). Circuit Diagram Symbol Rating Unit -0.3 -0.3~ 0~60 °C opr -25~85 T ° C stg 2 TCD2558D 2002-12-25 ...
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... V 3.2 3.5 SAT ¾ SE 0.35 ¾ V 0.5 DRK ¾ DSNU 5.0 ¾ P 430 D TTE 92 ¾ ¾ N 0.8 D ¾ V 0.5 RSN 3 TCD2558D Name = = = = 1 MHz Max Unit Note 12.1 V (Note 2) 12.9 /(lx/s) 7 (Note (Note 4) ¾ (Note 5) ¾ V (Note 6) ¾ Ix/s (Note 7) 2.0 mV (Note 8) 9.0 mV (Note 8) 600 mW ¾ ...
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... R G Note defined as average dark signal voltage of all effective pixels. DRK DSNU is defined as different voltage between V voltage. Note 9: DC signal output voltage is defined as follows. Reset noise voltage is defined as follows. and V when V is maximum dark signal DRK MDK MDK 4 TCD2558D 2002-12-25 ...
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... VfA “H” level “H” “L” level 0.0 “H” level 4 “L” level 0.0 “H” level 4 “L” level 0 TCD2558D Typ. Max Unit Note 5.0 5.5 V ¾ 0.5 VfA VfA “H” “H” V (Note 11) ¾ 0.5 5.0 5.5 V ¾ 0.5 5.0 5.5 V ¾ ...
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... Reset gate capacitance Clamp gate capacitance = 12 V Note 12 Symbol Min Typ. ff 0.3 1.0 f 0.3 1 0.3 1.0 CP ¾ (Note 12) Cf1 140 ¾ (Note 12) Cf2 120 ¾ ¾ ¾ TCD2558D Max Unit 10 MHz 10 MHz 10 MHz 210 pF 180 2002-12-25 ...
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... Timing Requirements 9 TCD2558D 2002-12-25 ...
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... CP Pulse “H” TCD2558D Typ. Max Unit (Note 13) ¾ 1000 ns ¾ 1000 ns ¾ ¾ 5000 ns ¾ 500 ns ¾ 100 ns ¾ ...
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... Typical Spectral Response 11 TCD2558D 2002-12-25 ...
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... Typical Drive Circuit IC1: TC74AC04 IC2: TC74HC04 TR1: 2SC1815-Y R1: 150 W R2: 1500 W 12 TCD2558D 2002-12-25 ...
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... Soldering by the solder flow method cannot be guaranteed because this method may have deleterious effects on prevention of window glass soiling and heat resistance. Using a soldering iron, complete soldering within ten seconds for lead temperatures 260°C, or within three seconds for lead temperatures 350° TCD2558D 2002-12-25 ...
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... Package Dimensions Note 1: Top of chip to bottom of package. Note 2: Glass thickness (n = 1.5) Note 3: No.1 sensor element (S1) to edge of No.1 pin. Weight: 5.2 g (typ.) 14 TCD2558D 2002-12-25 ...
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... TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. · The information contained herein is subject to change without notice. 15 TCD2558D 000707EBA 2002-12-25 ...