cxa1102m Sony Electronics, cxa1102m Datasheet - Page 14

• Manufacturer Part Number: cxa1102m
• Description: Dolby B Type Noise Reduction System
• Manufacturer: Sony Electronics

Package Outline
SONY CODE
EIAJ CODE
JEDEC CODE
16
1
SONY CODE
EIAJ CODE
JEDEC CODE
0.45 ± 0.1
CXA1101P, CXA1101P
CXA1102P, CXA1163P
CXA1101M, CXA1102M
CXA1163M
1.2 ± 0.15
16
0.5 ± 0.1
1
SOP-16P-L01
19.2 – 0.1
SOP016-P-0300-A
+ 0.4
2.54
9.9 – 0.1
+ 0.4
DIP-16P-01
Similar to MO-001-AE
16PIN SOP (PLASTIC) 300mil
DIP016-P-0300-A
9
16PIN DIP (PLASTIC) 300mil
8
9
8
Unit: mm
1.27
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE WEIGHT
± 0.12
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE WEIGHT
M
0.2 – 0.05
+ 0.1
EPOXY RESIN
COPPER ALLOY
0.2g
SOLDER PLATING
SOLDER PLATING
COPPER
EPOXY RESIN
1.0 g
1.85 – 0.15
0.1 – 0.05
+ 0.2
+ 0.4
0.15
0° to 15°
– 14 –
16
1
1.53 ± 0.15
SONY CODE
JEDEC CODE
EIAJ CODE
SONY CODE
EIAJ CODE
JEDEC CODE
0.46 ± 0.1
16
1
19.1 – 0.1
CXA1100P, CXA1101P
CXA1102P
+ 0.4
2.54
0.457 ± 0.076
19.35 ± 0.5
1.016
Similar to MO-001-AE
9
DIP-16P-03
DIP016-P-0300-B
DIP-16P-191
DIP016-P-0300-AU
8
MS-001-AA
16PIN DIP (PLASTIC) 300mil
16PIN DIP (PLASTIC) 300mil
9
8
2.54 ± 0.254
CXA1100/CXA1101/CXA1102/CXA1163
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE WEIGHT
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD MATERIAL
LEAD TREATMENT
PACKAGE WEIGHT
EPOXY RESIN
SOLDER PLATING
COPPER / 42 ALLOY
1.0g
EPOXY RESIN
SOLDER PLATING
COPPER
1.0g
0° to 15°
0° to 10°