cxa3221an Sony Electronics, cxa3221an Datasheet
cxa3221an
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cxa3221an Summary of contents
Page 1
... RX Gain Control Amplifier Description CXA3221AN gain control amplifier suitable for CDMA cellular/PCS phone. Features • Wide gain control range • Linear gain slope • Wideband operation (50MHz to 300MHz) • Very small package (8 Pin SSOP) • Low voltage operation • Power save function included Absolute Maximum Ratings • ...
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... Block Diagram CDMA IN IF Input for CDMA CDMA INX Gain control GCTL Supply Voltage V CC Ground GND Power Save PSV Pin Configuration CDMA INX Bias Driver GND 1 CDMA PSV 4 – 2 – OUT IF Output OUTX 8 GCTL OUTX 6 OUT 5 CXA3221AN ...
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... Description Ground Differential input pins for received CDMA IF signal. GND CC Power save function pin. High: Active Low: Power save V CC Differential output pins for received CDMA IF signal. Open collector output. GND Positive power supply. CC Gain control pin. CXA3221AN ...
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... Vpsv = 3.0V Vpsv = 0 V Vgctl = 3.0V Vgctl = 0.5V Pin 4 Pin 4 Conditions f = 210.38MHz, Vgctl = 2.4V Vgctl = 1.5V Vgctl = 0.6V Gain at Vgctl = 2.0V – Gain at Vgctl = 1. 40dB f1 = 209.38MHz 211.38MHz Measure of 210.38MHz 40dB Measure of 210.38MHz – 4 – CXA3221AN (V = 3.0V 27°C) CC Min. Typ. Max. Unit 10 µA –15 1 – ...
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... GND GCTL 2 CDMA CDMA INX OUTX 4 PSV OUT – 5 – V8 10k A8 0.01µ 0.01µ 1 OUTPUT 1.6k 1 TOKO, Inc. B5FL 616DS-1135 2 Coilcraft, Inc. 0805HS-181TKBC 3 Coilcraft, Inc. 0805HS-151TKBC V CC 0.01µ Gain Control Voltage 1k 8 100p 7 0.01µ 1000p 6 5 1000p CXA3221AN RX IF OUTPUT ...
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... This IC assumes the excellent characteristics when the differential input impedance between Pins 2 and 3 is 500 . Refer to the Measurement Circuit for the external element settings, etc. 4) Pay attention to handling this IC because its electrostatic discharge strength is weak. Conditions f = 210.38MHz, Vgctl = 1.5V – 6 – CXA3221AN (V = 3.0V 27°C) CC Typ. Unit k 1 ...
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... –2 –4 – –80 – 7 – CXA3221AN IIP3 –40° 27° 85°C –40 – Power gain [dB] Gain Error from Room Temp –40° 85°C –60 – ...
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... NOTE: Dimension " " does not include mold protrusion. 0˚ to 10˚ DETAIL A PACKAGE STRUCTURE PACKAGE MATERIAL EPOXY RESIN LEAD TREATMENT SOLDER PLATING SSOP-8P-L01 P-SSOP8-8.4x3.0-0.65 LEAD MATERIAL COPPER ALLOY 0.04g PACKAGE MASS ITEM SPEC. COPPER ALLOY Sn-Bi Bi:1-4wt% 5-18 m – 8 – CXA3221AN 0.1 0.1 Sony Corporation ...