MADP-042308-13060 MA-COM [M/A-COM Technology Solutions, Inc.], MADP-042308-13060 Datasheet - Page 4

• Manufacturer Part Number: MADP-042308-13060
• Description: SURMOUNTTM 8?M PIN Diodes
• Manufacturer: MA-COM [M/A-COM Technology Solutions, Inc.]

ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for
development. Performance is based on target specifications, simulated results, and/or prototype
measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under develop-
ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has
been fixed. Engineering samples and/or test data may be available. Commitment to produce in
volume is not guaranteed.
SURMOUNT
RoHS Compliant
All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin oils. The
use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components. Bulk handling should
insure that abrasion and mechanical shock are minimized.
Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are conveniently
located on the bottom surface of these devices and are removed from the active junction locations. These devices are well
suited for solder attachment onto hard and soft substrates. The use of 80Au/20Sn, or RoHS compliant solders is
recommended. For applications where the average power is ~1W, conductive silver epoxy may also be used. Cure per
manufacturers recommended time and temperature. Typically 1 hour at 150°C.
When soldering these devices to a hard substrate, hot gas die bonding is preferred. A vacuum tip pick-up tool and a force of
60 to100 grams applied to the top surface of the device is recommended. When soldering to soft substrates, such as Duroid, it
is recommended to use a soft solder at the circuit board to mounting pad interface. Position the die so that its mounting pads
are aligned with the circuit board mounting pads. While applying a downward force perpendicular to the top surface of the die,
apply heat near the circuit trace and diode mounting pad. The solder connection to the two pads should not be made one at a
time as this will create unequal heat flow and thermal stress to the part. Solder reflow should not be performed by causing heat
to flow through the top surface of the die to the back. Since the HMIC glass is transparent, the edges of the mounting pads
can be visually inspected through the die after attachment is completed.
Typical re-flow profiles for Sn60/Pb40 and RoHS compliant solders is provided in
Instructions“ and can viewed on the MA-COM website @
The MADP-042XX8-13060 series of surmounts may be ordered in either gel packs or tape and reeled by adding the
appropriate suffix per the table below. Tape and reel dimensions are provided in
M/A-COM website @
MADP-042XX8-13060 Series
MADP-042308-13060G
MADP-042408-13060G
MADP-042508-13060G
MADP-042908-13060G
Gel Pack
TM
8µM PIN Diodes
www.macom.com
.
Handling Procedures
Ordering Information
Bonding Techniques
Tape and Reel (Surf Tape)
MADP-042308-13060T
MADP-042408-13060T
MADP-042508-13060T
MADP-042908-13060T
Part Number
www.macom.com
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or
information contained herein without notice.
• North America Tel: [phone] / Fax: [phone]
• Europe Tel: [phone] / Fax: [phone]
• Asia/Pacific Tel: [phone] / Fax: [phone]
Visit www.macom.com for additional data sheets and product information.
Application Note M538
Application Note M513
Tape and Reel (Pocket Tape)
MADP-042308-13060P
MADP-042408-13060P
MADP-042508-13060P
MADP-042908-13060P
M/A-COM Products
, “Surface Mounting
located on the
Rev. V1