RF3140PCBA-41X RFMD [RF Micro Devices], RF3140PCBA-41X Datasheet

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RF3140PCBA-41X

Manufacturer Part Number
RF3140PCBA-41X
Description
QUAD-BAND GSM850/GSM900/DCS/PCS POWER AMP MODULE
Manufacturer
RFMD [RF Micro Devices]
Datasheet
Product Description
The RF3140 is a high-power, high-efficiency power ampli-
fier module with integrated power control. The device is
self-contained with 50Ω input and output terminals. The
power control function is also incorporated, eliminating
the need for directional couplers, detector diodes, power
control ASICs and other power control circuitry; this
allows the module to be driven directly from the DAC out-
put. The device is designed for use as the final RF ampli-
fier in GSM850, EGSM900, DCS and PCS handheld
digital cellular equipment and other applications in the
824MHz to 849MHz, 880MHz to 915MHz, 1710MHz to
1785MHz and 1850MHz to 1910MHz bands. On-board
power control provides over 50dB of control range with an
analog voltage input; and, power down with a logic “low”
for standby operation.
Optimum Technology Matching® Applied
Rev A9 060217
GSM850/GSM900 IN
Typical Applications
• 3V Quad-Band GSM Handsets
• Commercial and Consumer Systems
• Portable Battery-Powered Equipment
Si BJT
Si Bi-CMOS
InGaP/HBT
BAND SELECT
DCS/PCS IN
TX ENABLE
VRAMP
VBATT
VREG
Functional Block Diagram
1
2
3
4
5
6
7
GaAs HBT
SiGe HBT
GaN HEMT
12
8
0
Pb-Free Product
GaAs MESFET
Si CMOS
SiGe Bi-CMOS
11
10
9
DCS/PCS OUT
VCC OUT
GSM850/GSM900 OUT
• GSM850/EGSM900/DCS/PCS Products
• GPRS Class 12 Compatible
• Power Star
Features
Ordering Information
RF Micro Devices, Inc.
7628 Thorndike Road
Greensboro, NC 27409, USA
• Complete Power Control Solution
• Single 3.0V to 5.5V Supply Voltage
• +35dBm GSM Output Power at 3.5V
• +33dBm DCS/PCS Output Power at 3.5V
• 60% GSM and 55% DCS/PCS
• 10mmx10mm Package Size
RF3140
RF3140
RF3140PCBA-41XFully Assembled Evaluation Board
QUAD-BAND GSM850/GSM900/DCS/PCS
Package Style: Module (10mmx10mm)
TM
9.600 TYP
8.800 TYP
8.200 TYP
7.400 TYP
6.800 TYP
6.000 TYP
5.400 TYP
4.600 TYP
4.000 TYP
3.200 TYP
2.600 TYP
1.800 TYP
1.200 TYP
0.400 TYP
Quad-Band GSM850/GSM900/DCS/PCS Power
Amp Module
Power Amp Module 5-Piece Sample Pack
0.000
Module
Pin 1
10.00 ± 0.10
POWER AMP MODULE
± 0.10
10.00
RF3140
Pin 1
8.747
5.925
4.075
1.245
0.306
1.70
1.45
0.450
± 0.075
http://www.rfmd.com
Fax (336) 664 0454
Tel (336) 664 1233
η
EFF
2-491

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RF3140PCBA-41X Summary of contents

Page 1

... GSM and 55% DCS/PCS 11 DCS/PCS OUT • 10mmx10mm Package Size 10 VCC OUT Ordering Information 9 GSM850/GSM900 OUT RF3140 RF3140 RF3140PCBA-41XFully Assembled Evaluation Board RF Micro Devices, Inc. 7628 Thorndike Road Greensboro, NC 27409, USA RF3140 POWER AMP MODULE Module TM 9.600 TYP Pin 1 8.800 TYP 8 ...

Page 2

RF3140 Absolute Maximum Ratings Parameter Supply Voltage Power Control Voltage (V ) RAMP Input RF Power Max Duty Cycle Output Load VSWR Operating Case Temperature Storage Temperature Parameter Min. Overall Power Control V RAMP Power Control “ON” Power Control “OFF” ...

Page 3

Parameter Min. Overall (GSM850 Mode) Operating Frequency Range Maximum Output Power +34.2 Total Efficiency Input Power Range Output Noise Power Forward Isolation 1 Forward Isolation 2 Cross Band Isolation Second Harmonic Third Harmonic All Other Non-Harmonic Spurious ...

Page 4

RF3140 Parameter Min. Overall (GSM900 Mode) Operating Frequency Range Maximum Output Power +34.2 Total Efficiency Input Power Range Output Noise Power Forward Isolation 1 Forward Isolation 2 Cross Band Isolation 2f 0 Second Harmonic Third Harmonic All Other Non-Harmonic Spurious ...

Page 5

Parameter Min. Overall (DCS Mode) Operating Frequency Range Maximum Output Power +29.5 Total Efficiency Input Power Range Output Noise Power Forward Isolation 1 Forward Isolation 2 Second Harmonic Third Harmonic All Other Non-Harmonic Spurious Input Impedance Input VSWR Output Load ...

Page 6

RF3140 Parameter Min. Overall (PCS Mode) Operating Frequency Range Maximum Output Power +29.5 Total Efficiency Input Power Range Output Noise Power Forward Isolation 1 Forward Isolation 2 Second Harmonic Third Harmonic All Other Non-Harmonic Spurious Input Impedance Input VSWR Output ...

Page 7

Pin Function Description 1 DCS/PCS IN RF input to the DCS/PCS band. This is a 50Ω input. 2 BAND Allows external control to select the GSM or DCS/PCS bands with a logic high or low. A logic low enables the ...

Page 8

RF3140 PIN #1 DCS/PCS IN BAND SELECT TX EN VBATT VREG VRAMP GSM850/GSM900 IN 2-498 Pin Out DCS/PCS OUT VCC OUT GSM850/GSM900 OUT 10.0000 10.0000 Rev A9 060217 ...

Page 9

Overview The RF3140 is a quad-band GSM850, EGSM900, DCS1800, and PCS1900 power amplifier module that incorporates an indirect closed loop method of power control. This simplifies the phone design by eliminating the need for the compli- cated control loop design. ...

Page 10

RF3140 Talk time and power management are key concerns in transmitter design since the power amplifier has the highest cur- rent draw in a mobile terminal. Considering only the power amplifier’s efficiency does not provide a true picture for the ...

Page 11

The switching transients due to low battery conditions are regulated by incorporating the following relationship limiting the maximum V voltage (Equation 4). Although no compensation is required for typical battery conditions, the bat- RAMP tery compensation required for extreme conditions ...

Page 12

RF3140 Switching transients occur when the up and down ramp of the burst is not smooth enough or suddenly changes shape. If the control slope has an inflection point within the output power range or if the ...

Page 13

DCS/PCS IN BAND SELECT TX ENABLE VBATT VREG VRAMP 50 Ω μstrip GSM850/GSM900 IN ** Used to filter noise and spurious from base band. Evaluation Board Schematic 50 Ω μstrip J2 DCS/PCS IN R6* 180 Ω BAND ...

Page 14

RF3140 Board Thickness 0.032”, Board Material FR-4, Multi-Layer 2-504 Evaluation Board Layout Board Size 2.0” x 2.0” Rev A9 060217 ...

Page 15

PCB Surface Finish The PCB surface finish used for RFMD’s qualification process is electroless nickel, immersion gold. Typical thickness is 3μinch to 8μinch gold over 180μinch nickel. PCB Land Pattern Recommendation PCB land patterns are based on IPC-SM-782 standards when ...

Page 16

RF3140 Thermal Pad and Via Design The PCB land pattern has been designed with a thermal pad that matches the exposed die paddle size on the bottom of the device. Thermal vias are required in the PCB layout to effectively ...

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