RF5111PCBA-41X RFMD [RF Micro Devices], RF5111PCBA-41X Datasheet
RF5111PCBA-41X
Related parts for RF5111PCBA-41X
RF5111PCBA-41X Summary of contents
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... Operation 12 RF OUT • Supports DCS1800 and PCS1900 11 RF OUT 10 RF OUT Ordering Information RF5111 RF5111PCBA-41X Fully Assembled Evaluation Board RF Micro Devices, Inc. 7628 Thorndike Road Greensboro, NC 27409, USA RF5111 3V DCS POWER AMPLIFIER 0. -A- 1.00 2 PLCS 3.00 SQ. 0.85 1.50 TYP ...
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RF5111 Absolute Maximum Ratings Parameter Supply Voltage Power Control Voltage (V ) APC Enable Voltage (V ) AT_EN DC Supply Current Input RF Power Duty Cycle at Max Power Output Load VSWR Operating Case Temperature Storage Temperature Parameter Min. Overall ...
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Parameter Min. Power Control Power Control “ON” Power Control “OFF” Power Control Range Gain Control Slope APC Input Capacitance APC Input Current Turn On/Off Time Power Supply Power Supply Voltage Power Supply Current Rev A1 060921 Specification Typ. Max. 3.0 ...
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RF5111 Pin Function Description 1 VAT EN Control pin for the pin diode. The purpose of the pin diode is to attenu- ate RF drive level when V through the device caused by self-biasing under high RF drive levels. A ...
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Pin Function Description 14 VCC2 Power supply for the driver stage. This pin forms the shunt inductance needed for proper tuning of the second interstage match. 15 VCC2 Same as pin 14. 16 VCC2 Same as pin 14. Pkg GND ...
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RF5111 Theory of Operation and Application Information The RF5111 is a three-stage device with 28 dB gain at full power. Therefore, the drive required to fully saturate the out- put is +5dBm. Based upon HBT (Heterojunction Bipolar Transistor) technology, the ...
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Because of the inverting stage at the APC input, the current through the PIN diode is inverted from the APC voltage. Thus, when V is high for maximum output power, the attenuator is turned off to obtain maximum drive level ...
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RF5111 Distance between edge of device and capacitor is 0.240" to improve the "off" isolation 2-8 Application Schematic Instead of a stripline, an inductor can be used V ...
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RF IN 750 Ω 500 Ω VCC 5k Ω 3k Ω APC1 AT_EN 1.5k Ω Rev A1 060921 Internal Schematic VCC1 APC1 500 Ω 320 Ω 2.5k Ω 2.5k Ω GND1 RF5111 VCC2 VCC APC2 VCC 200 Ω 1.5k Ω ...
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RF5111 Evaluation Board Schematic Dual-Band DCS/PCS Lumped Element VAT EN C25 C24 Ω μstrip VCC 100 mils C3 C3A ...
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Board Thickness 0.032”, Board Material FR-4, Multi-Layer Rev A1 060921 Evaluation Board Layout Board Size 2.0” x 2.0” RF5111 2-11 ...
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RF5111 RF Generator 3dB Pulse Generator Notes about testing the RF5111 The test setup shown above includes two attenuators. The 3dB pad at the input is to minimize the effects that the switch- ing of the input impedance of the ...
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PCB Surface Finish The PCB surface finish used for RFMD’s qualification process is electroless nickel, immersion gold. Typical thickness is 3μinch to 8μinch gold over 180μinch nickel. PCB Land Pattern Recommendation PCB land patterns are based on IPC-SM-782 standards when ...
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RF5111 PCB Solder Mask Pattern Liquid Photo-Imageable (LPI) solder mask is recommended. The solder mask footprint will match what is shown for the PCB metal land pattern with a 2mil to 3mil expansion to accommodate solder mask registration clearance around ...