ECG015B ETC [List of Unclassifed Manufacturers], ECG015B Datasheet - Page 4

• Manufacturer Part Number: ECG015B
• Description: 1/4 Watt, High Linearity InGaP HBT Amplifier
• Manufacturer: ETC [List of Unclassifed Manufacturers]

Thermal Specifications
Notes:
1. The thermal resistance is referenced from the
2. This corresponds to the typical biasing condition of
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: [phone] • e-mail: [e-mail] • Web site: www.wj.com
Parameter
Operating Case Temperature
Thermal Resistance, Rth
Junction Temperature, Tjc
junction-to-case at a case temperature of 85° C.
+5V, 100 mA at an 85° C case temperature. A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 247° C.
ECG015
¼ Watt, High Linearity InGaP HBT Amplifier
ECG015B (SOT-89 Package) Mechanical Information
(1)
(2)
Outline Drawing
Land Pattern
Rating
-40 to +85° C
128° C / W
149° C
This package may contain lead-bearing materials.
100000
10000
1000
100
60
MTTF vs. GND Tab Temperature
70
Tab Temperature (°C)
80
90
100
110
120
The Communications Edge
The component will be marked with an “E015”
designator with an alphanumeric lot code on the
top surface of the package.
Tape and reel specifications for this part are
located on the website in the “Application Notes”
section.
Specifications and information are subject to change without notice
1. Ground / thermal vias are critical for the proper
2. Add as much copper as possible to inner and outer layers
3. Mounting screws can be added near the part to fasten the
4. Do not put solder mask on the backside of the PC board in
5. RF trace width depends upon the PC board material and
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in
ESD Rating: Class 1B
Value:
Test:
Standard:
MSL Rating: Level 3 at +240 °C convection reflow
Standard:
Mounting Config. Notes
performance of this device. Vias should use a .35mm (#80
/ .0135”) diameter drill and have a final plated thru
diameter of .25 mm (.010”).
near the part to ensure optimal thermal performance.
board to a heatsink. Ensure that the ground / thermal via
region contacts the heatsink.
the region where the board contacts the heatsink.
construction.
degrees.
ESD / MSL Information
Product Marking
Passes at between 500 and 1000V
Human Body Model (HBM)
JEDEC Standard J-STD-020
JEDEC Standard JESD22-A114
Product Information
September 2004
TM