LTC1865 LINER [Linear Technology], LTC1865 Datasheet - Page 19

• Manufacturer Part Number: LTC1865
• Description: Ultra-Tiny, Differential, 16-Bit ADC with SPI Interface SPI Interface
• Manufacturer: LINER [Linear Technology]

PACKAGE DESCRIPTION
2.55 ±0.05
(SEE NOTE 6)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.15 ±0.05
TOP MARK
PIN 1 BAR
0.25 ± 0.05
0.61 ±0.05
0.200 REF
(2 SIDES)
NOTE:
1. DRAWING CONFORMS TO VERSION (WECD-1) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
3.00 ±0.10
2.20 ±0.05
(2 SIDES)
(2 SIDES)
(Reference LTC DWG # 05-08-1702 Rev B)
0.50 BSC
8-Lead Plastic DFN (3mm × 2mm)
2.00 ±0.10
0.75 ±0.05
(2 SIDES)
0.70 ±0.05
DDB Package
PACKAGE
OUTLINE
0 – 0.05
R = 0.05
0.56 ± 0.05
(2 SIDES)
TYP
BOTTOM VIEW—EXPOSED PAD
0.25 ± 0.05
R = 0.115
TYP
4
5
2.15 ±0.05
(2 SIDES)
8
1
0.50 BSC
0.40 ± 0.10
PIN 1
R = 0.20 OR
0.25 × 45°
CHAMFER
(DDB8) DFN 0905 REV B
LTC2452
19
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