UPC2714T NEC, UPC2714T Datasheet - Page 8

• Manufacturer Part Number: UPC2714T
• Description: 1.8 GHz LOW POWER CONSUMPTION WIDE BAND AMPLIFIER SILICON BIPOLAR MONOLITHIC INTEGRATED CIRCUIT
• Manufacturer: NEC

NOTE ON CORRECT USE
RECOMMENDED SOLDERING CONDITIONS
conditions than the recommended conditions are to be consulted with our sales representatives.
m
8
PC2714T
Infrared ray reflow
VPS
Wave soldering
Pin part heating
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as wide as possible to prevent an increase in ground impedance (which can cause
(3) Keep the track length of the ground pins as short as possible.
(4) Connect a bypass capacitor (having, for example, a capacitance of 1 000 pF) to the V
This product should be soldered in the following recommended conditions.
*: It is the storage days after opening a dry pack, the storage conditions are 25 °C, less than 65 % RH.
Note 1. The combined use of soldering method is to be avoided (However, except the pin area heating method).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
abnormal oscillation).
Soldering method
Hour: within 30 s. (more than 210 °C),
Time: 3 times, Limited days; no.*
Package peak temperature: 215 °C,
Hour: within 40 s. (more than 200 °C),
Time: 3 times, Limited days: no.*
Hour: within 10 s.
Time: 1 time, Limited days: no.*
Pin area temperature: less than 300 °C,
Hour: within 3 s.
Limited days: no.*
Package peak temperature: 235 °C,
Soldering tub temperature: less than 260 °C,
Soldering conditions
Other soldering methods and
CC
Recommended condition
symbols
pin.
WS60-00-1
VP15-00-3
IR35-00-3
PC2714T