UPC8126K NEC, UPC8126K Datasheet - Page 17

• Manufacturer Part Number: UPC8126K
• Description: 900 MHz BAND DIRECT QUADRATURE MODULATOR IC FOR DIGITAL MOBILE COMMUNICATION SYSTEMS
• Manufacturer: NEC

NOTE ON CORRECT USE
(1) Observe precautions for handling because of electrostatic sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired operation).
(3) Keep the track length between the ground pins as short as possible.
(4) Connect a bypass capacitor (example 1 000 pF) to the V
RECOMMENDED SOLDERING CONDITIONS
conditions other than those recommended below, contact your NEC sales representative.
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
Infrared Reflow
Partial Heating
Soldering Method
This product should be soldered under the following recommended condition.
Note After opening the dry pack, keep it in a place below 25°C and 65% RH for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
For details of recommended soldering conditions for surface mounting, refer to information document
Package peak temperature: 235°C or below
Time: 30 seconds or less (at 210°C)
Count: 2, Exposure limit
Pin temperature: 300°C
Time: 3 seconds or less (per side of device)
Exposure limit
Note
: None
Preliminary Data Sheet P13488EJ1V0DS00
Note
Soldering Conditions
: None
CC
pin.
For soldering methods and
Recommended Condition
Symbol
IR35-00-2
PC8126K
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