VSC8115YA1 VITESSE [Vitesse Semiconductor Corporation], VSC8115YA1 Datasheet - Page 12

• Manufacturer Part Number: VSC8115YA1
• Description: STS-12/STS-3 Multi Rate Clock and Data Recovery Unit
• Manufacturer: VITESSE [Vitesse Semiconductor Corporation]

STS-12/STS-3 Multi Rate
Clock and Data Recovery Unit
Page 12
Package Thermal Characteristics
JEDEC package outline standards. It has hi-conductivity copper lead frames and a very low-stress mold com-
pound. The junction to case thermal resistance is 80
single-layer PCB applications. The air flow versus thermal resistance relationship for multi-layer PCB applica-
tions is shown in Table 11.
Ordering Information
Notice
is subject to change without notice at any time. All features and specification are design goals only. Please con-
tact Vitesse Semiconductor to obtain the latest product status and most recent versions of this specification.
Warning
systems. Use of a Vitesse product in such applications without the written consent is prohibited.
Air Velocity
(LFPM)
The VSC8115 is packaged in a Thin Shrink Small Outline Package (TSSOP). This package conforms to
The order number for this product are:
Part Number
VSC8115YA:
VSC8115YA1
VSC8115YA2
This document contains information about a proposed product during its design phase of development and
Vitesse Semiconductor Corporation’s product are not intended for use in life support appliances, devices or
100
200
400
0
Case to Air
Resistance
741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: [phone]
Thermal
(
o
55.0
52.0
49.0
46.0
C/W)
Table 11: Theta Case to Ambient versus Air Velocity
Device Type
STS-12/STS-3 Multi-Rate Clock and Data Recovery Unit in a 20 Pin TSSOP
Commercial Temperature, 0 C ambient to 70 C case
STS-12/STS-3 Multi-Rate Clock and Data Recovery Unit in a 20 Pin TSSOP
Extended Temperature, 0 C ambient to 110 C case
STS-12/STS-3 Multi-Rate Clock and Data Recovery Unit in a 20 Pin TSSOP
Industrial Temperature, -40 C ambient to 85 C case
VITESSE
VITESSE SEMICONDUCTOR CORPORATION
SEMICONDUCTOR CORPORATION
15.4
14.6
13.7
12.9
(0
o
C to 75
YA
to
to
to
to
o
C ) Tcase
59.6
60.4
61.3
62.1
o
Ta (Ambient Temperature) Range (
C/W for multi-layer PCB applications and 126
(0
15.4
14.6
13.7
12.9
o
C to 103
YA1
to
to
to
to
o
C ) Tcase
87.6
88.4
89.3
90.1
Target Specification
(-40
-55.4
-54.6
-53.7
-52.9
o
C)
o
C to 85
YA2
VSC8115
to
to
to
to
o
G52272-0, Rev. 1.1
C ) Tcase
o
C/W for
69.6
70.4
71.3
72.1
9/29/00