HCPL-2300300 HP [Agilent(Hewlett-Packard)], HCPL-2300300 Datasheet - Page 4

• Manufacturer Part Number: HCPL-2300300
• Description: 8 MBd Low Input Current Optocoupler
• Manufacturer: HP [Agilent(Hewlett-Packard)]

Thermal Profile (Option #300)
Figure 1. Maximum Solder Reflow Thermal Profile.
(Note: Use of non-chlorine activated fluxes is recommended.)
Regulatory Information
The HCPL-2300 has been
approved by the following
organizations:
UL
Recognized under UL 1577,
Component Recognition
Program, File E55361.
Insulation and Safety Related Specifications
Option 300 – surface mount classification is Class A in accordance with CECC 00802.
Min. External Air Gap
(External Clearance)
Min. External Tracking Path
(External Creepage)
Min. Internal Plastic Gap
(Internal Clearance)
Tracking Resistance
(Comparative Tracking Index)
Isolation Group
260
240
220
180
160
140
120
100
200
80
60
20
40
0
0
Parameter
1
T = 115°C, 0.3°C/SEC
2
T = 100°C, 1.5°C/SEC
3
4
TIME – MINUTES
5
Symbol
6
L(IO1)
L(IO2)
CTI
CSA
Approved under CSA Component
Acceptance Notice #5, File CA
88324.
VDE
Approved according to VDE
0884/06.92 (Option 060 only)
7
8
Value Units
0.08
200
IIIa
7.1
7.4
9
T = 145°C, 1°C/SEC
10
Volts
mm
mm
mm
11
12
Measured from input terminals to output
terminals, shortest distance through air
Measured from input terminals to output
terminals, shortest distance path along body
Through insulation distance, conductor to
conductor, usually the direct distance
between the photoemitter and photodetector
inside the optocoupler cavity
DIN IEC 112/VDE 0303 PART 1
Material Group (DIN VDE 0110, 1/89, Table 1)
Conditions
1-291