ADG602 AD [Analog Devices], ADG602 Datasheet - Page 4

• Manufacturer Part Number: ADG602
• Description: 2 ohm CMOS +-5 V/5 V, SPST SWITCHES
• Manufacturer: AD [Analog Devices]

ADG601/ADG602
ABSOLUTE MAXIMUM RATINGS
(T
V
V
V
Analog Inputs
Digital Inputs
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . 100 mA
Peak Current, S or D
Operating Temperature Range
Storage Temperature Range . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Micro-SOIC Package
SOT_23 Package
Lead Temperature, Soldering (10 seconds) . . . . . . . . . 300°C
IR Reflow, Peak Temperature . . . . . . . . . . . . . . . . . . . 220°C
NOTES
1
2
Model
ADG601BRT
ADG601BRM
ADG602BRT
ADG602BRM
*Branding on SOT_23 and Micro-SOIC packages is limited to three characters due to space constraints.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the ADG601/ADG602 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions
are recommended to avoid performance degradation or loss of functionality.
Stresses above those listed under Absolute Maximum Ratings may cause perma-
Overvoltages at IN, S, or D will be clamped by internal diodes. Current should be
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
limited to the maximum ratings given.
DD
DD
SS
A
(Pulsed at 1 ms, 10% Duty Cycle Max) . . . . . . . . . 200 mA
Industrial (B Version) . . . . . . . . . . . . . . . –40°C to +85°C
θ
θ
θ
θ
= 25°C unless otherwise noted)
JA
JC
JA
JC
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –6.5 V
to V
to GND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +6.5 V
Thermal Impedance . . . . . . . . . . . . . . . . . . . . 206°C/W
Thermal Impedance . . . . . . . . . . . . . . . . . . 229.6°C/W
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 44°C/W
Thermal Impedance . . . . . . . . . . . . . . . . . . 91.99°C/W
SS
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 V
2
2
. . . . . . . . . . . . . . . . . V
. . . . . . . . . . . . . . . . . . . . –0.3 V to V
Temperature Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
or 30 mA, whichever occurs first
1
SS
–0.3 V to V
Package Description
Plastic Surface-Mount (SOT_23)
Micro Small Outline (Micro-SOIC)
Plastic Surface-Mount (SOT_23)
Micro Small Outline (Micro-SOIC)
DD
DD
ORDERING GUIDE
+0.3 V
+0.3 V
–4–
6-Lead Plastic Surface Mount (SOT_23)
8-Lead Small Outline Micro-SOIC
Package Option
RT-6
RM-8
RT-6
RM-8
PIN CONFIGURATIONS
V
V
V
NC
NC
DD
DD
SS
S
D
NC = NO CONNECT
1
2
3
4
1
2
3
(Not to Scale)
(Not to Scale)
TOP VIEW
TOP VIEW
ADG601/
(RM-8)
ADG601/
ADG602
(RT-6)
ADG602
WARNING!
8
7
6
5
8
7
6
Branding Information
STB
STB
SUB
SUB
IN
D
GND
S
GND
IN
V
SS
ESD SENSITIVE DEVICE
REV. 0
*