TEA152X PHILIPS [NXP Semiconductors], TEA152X Datasheet - Page 13

• Manufacturer Part Number: TEA152X
• Description: SMPS ICs for low-power systems
• Manufacturer: PHILIPS [NXP Semiconductors]

NXP Semiconductors
14. Package outline
Fig 7.
TEA152X_3
Product data sheet
DIP8: plastic dual in-line package; 8 leads (300 mil)
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
inches
UNIT
mm
Package outline SOT97-1 (DIP8)
VERSION
OUTLINE
SOT97-1
max.
0.17
4.2
A
min.
0.02
0.51
A
1
L
050G01
max.
0.13
A
3.2
IEC
Z
2
8
1
pin 1 index
0.068
0.045
1.73
1.14
b
b
D
e
0.021
0.015
0.53
0.38
b
1
MO-001
JEDEC
0.042
0.035
1.07
0.89
4
5
b
b
REFERENCES
1
2
0
Rev. 03 — 23 March 2009
A
b
0.014
0.009
1
2
0.36
0.23
w
c
E
A
M
2
SC-504-8
JEITA
scale
D
0.39
0.36
A
9.8
9.2
5
(1)
6.48
6.20
0.26
0.24
E
(1)
10 mm
2.54
0.1
e
7.62
0.3
e
c
1
SMPS ICs for low-power systems
3.60
3.05
0.14
0.12
(e )
M
L
M
PROJECTION
EUROPEAN
1
H
E
8.25
7.80
0.32
0.31
M
E
10.0
0.39
0.33
M
8.3
H
TEA152x
© NXP B.V. 2009. All rights reserved.
ISSUE DATE
0.254
0.01
99-12-27
03-02-13
w
SOT97-1
0.045
max.
1.15
Z
(1)
13 of 17