SA58643DP PHILIPS [NXP Semiconductors], SA58643DP Datasheet

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SA58643 Single-Pole Double-Throw (SPDT) switch Rev. 01 — 20 November 2006 1. General description The SA58643 is a wideband RF switch fabricated in BiCMOS technology and incorporating on-chip CMOS/TTL compatible drivers. Its primary function is to switch signals in the ...

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... AC_GND OUT1 SA58643_1 Product data sheet Ordering information Package Name Description TSSOP8 plastic thin shrink small outline package; 8 leads; body width 3 mm input/output ENCH1 ENCH1 2 SA58643DP 3 GND INPUT 4 Pin description Pin Description 1 supply voltage 2 enable channel ground 4 input 5 output ...

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NXP Semiconductors 7. Equivalent circuit INPUT ENCH1 (logic 0 level) Fig 3. Equivalent circuit 8. Limiting values Table 3. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol j(max) P INPUT_OUT1_OUT2 T stg [1] ...

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NXP Semiconductors 10. Static characteristics Table 5. Static characteristics unless otherwise specified. DD amb Symbol Parameter I supply current DD V threshold voltage th V HIGH-level input voltage IH V LOW-level input ...

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NXP Semiconductors 12. Performance curves 200 160 120 T = +85 C amb + 3.0 4.0 Fig 4. Supply current versus V 0 (dB) 1 ...

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NXP Semiconductors (dB CH2 CH1 + amb DD Fig 10. Isolation matching versus frequency; CH1 versus CH2 (dB ...

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NXP Semiconductors 60 intercept point (dBm) 50 IP2 40 IP3 3.0 4 +25 C amb Fig 16. Intercept points versus V ENCH1 (pin 2) OUT1 (pin 100 MHz at 6 dBm; ...

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NXP Semiconductors 13. Application information 13.1 Evaluation demo board The typical applications schematic and printed-circuit board layout of the SA58643 evaluation board is shown in cautions need to be observed. The input and output traces should The ...

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... NXP Semiconductors The SA58643DP evaluation demo board (see provides a stable RF layout. The demo circuit (see schematic) is constructed on 2-layer, 1-ounce copper, FR4 PCB material. The overall thickness is 0.062 inches and has a dielectric constant, are modeled for coplanar waveguide with both top and bottom ground. The 50 transmission line width is 1 ...

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NXP Semiconductors Fig 20. A typical TDMA/digital RF transceiver system front-end oscillator Fig 21. Amplitude Shift Keying (ASK) Fig 23. Cascaded configuration SA58643_1 Product data sheet 5200 SA58643 TX/RX 5200 ASK output SA58643 50 enable CH1 TTL data 002aab694 generator ...

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NXP Semiconductors 14. Package outline TSSOP8: plastic thin shrink small outline package; 8 leads; body width pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT ...

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NXP Semiconductors 15. Soldering This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description” . 15.1 Introduction to soldering Soldering ...

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NXP Semiconductors 15.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see reducing the process window • Solder paste printing issues including ...

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NXP Semiconductors Fig 25. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description” . 16. Abbreviations Table 9. Acronym ASK BiCMOS CMOS DC ESD FSK OOK ...

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NXP Semiconductors 18. Legal information 18.1 Data sheet status [1][2] Document status Product status Objective [short] data sheet Development Preliminary [short] data sheet Qualification Product [short] data sheet Production [1] Please consult the most recently issued document before initiating or ...

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NXP Semiconductors 20. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...