OPA622AP BURR-BROWN [Burr-Brown Corporation], OPA622AP Datasheet - Page 15

• Manufacturer Part Number: OPA622AP
• Description: Wide-Bandwidth OPERATIONAL AMPLIFIER
• Manufacturer: BURR-BROWN [Burr-Brown Corporation]

when a signal is applied. For high-speed op amps, a more
precise approach to determine power consumption is to
measure the average total quiescent current for several
typical load conditions. The power consumption of the
OPA622 is influenced by the signal type and frequency, the
output voltage and load resistor, and the repetition rate of the
signal transitions. Figure 14 shows the total average supply
current versus the frequency of an applied sine wave for
various output voltages. Figure 15
quiescent current versus the repetition frequency of an
applied square wave signal.
CIRCUIT LAYOUT
The high-frequency performance of the OPA622 can be
greatly affected by the physical layout of the printed circuit
board. The following tips are offered as suggestions, not as
absolute musts. Oscillations, ringing, poor bandwidth and
settling, and peaking are all typical problems that plague
high-speed components when they are used incorrectly.
• Bypass power supplies very close to the device pins. Use
• PC board traces for power lines should be wide to reduce
FIGURE 11. Optimum Response vs Closed-Loop Gains.
FIGURE 12. Closed-Loop Gain vs R
tantalum chip capacitors (approximately 2.2 F) and a
parallel 470pF ceramic chip capacitor. Surface-mount types
are recommended because of their low lead inductance.
impedance.
–10
–15
–20
–25
–30
–10
–15
–20
–25
20
15
10
–5
10
–5
5
0
5
0
100k
100k
V
recommended component values.
G
G
G
G
G
G
O
CL
CL
CL
CL
CL
CL
= 1.4Vp-p, Refer to Table I for
= +10
= +2
= +1
= –1
= –2
= +2V/V
OPA622AP
1M
1M
R
R
R
OG
OG
OG
R
R
R
R
R
= 50
= 150
= 300
OG
OG
OG
OG
OG
Frequency (Hz)
Frequency (Hz)
= 10
= 150
= 390
= 200
= 120
10M
10M
OG
.
illustrates the total
100M
1M
1G
1G
15
• Make short, low-inductance traces. The entire physical
• Use a low-impedance ground plane on the component side
• Place the R
• Do not extend the ground plane over high-impedance
• Sockets are not recommended, because they add signifi-
• Use low-inductance, surface-mount components for
• A resistor (50
• Plug-in prototype boards and wire-wrap boards will not
FIGURE 13. Bandwidth vs C
FIGURE 14. Average Supply Current vs Frequency (Sine Wave).
circuit should be as small as possible.
to ensure that low-impedance ground is available through-
out the layout.
and use the shortest possible trace length.
nodes sensitive to stray capacitances such as the amplifier’s
input and R
cant inductance and parasitic capacitance. If sockets are
required, use zero-profile solderless sockets.
best AC performance.
ance inputs is strictly recommended for stable operation.
function well. A clean layout using RF techniques is
essential.
50
40
30
20
10
0
300k
G
CL
= +2V/V, V
OG
OG
resistor as close as possible to the package
terminals.
1M
to 330 ) in series with the high-imped-
1M
O
G = +2V/V, R
= 2.8Vp-p
Frequency (Hz)
Frequency (Hz)
10M
LOAD
C
LOAD
10p180
10M
22p200
47p150
LOAD
47pF
22pF
10pF
OPA622
.
= 100
R
OG
0.5p
0.5p
C
100M
0.5p
100M
OTA
5Vp-p
2.8Vp-p
1.4Vp-p
0.2Vp-p
1G
1G
®