W25X20BV WINBOND [Winbond], W25X20BV Datasheet - Page 44

• Manufacturer Part Number: W25X20BV
• Description: 1M-BIT, 2M-BIT AND 4M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL I/O SPI
• Manufacturer: WINBOND [Winbond]

11.1 8-Pin SOIC 150-mil (Package Code SN)
Notes:
1. Controlling dimensions: millimeters, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package.
4. Formed leads coplanarity with respect to seating plane shall be within 0.004 inches
11. PACKAGE SPECIFICATION
SEATING PLANE
Y
8

1
SYMBOL
D
E
Y
e
A1
H
A
b

c
L
(2)
(4)
(3)
(3)
E
b
D
e
1.35
0.10
0.33
0.19
3.80
4.80
5.80
0.40
Min
0°
-
5
4
MILLIMETERS
1.27 BSC
A1
- 44 -
A
E
H
E
Max
0.51
0.25
4.00
5.00
6.20
0.10
1.75
0.25
1.27
10°
W25X10BV/20BV/40BV
.
0.053
0.004
0.013
0.008
0.150
0.188
0.228
0.016
Min
0°
-
0.050 BSC
INCHES
0.069
0.010
0.020
0.010
0.157
0.196
0.244
0.004
0.050
Max
10°
0.25
GAUGE PLANE
c
L
O