W25X20BV WINBOND [Winbond], W25X20BV Datasheet - Page 48

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W25X20BV

Manufacturer Part Number
W25X20BV
Description
1M-BIT, 2M-BIT AND 4M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL I/O SPI
Manufacturer
WINBOND [Winbond]
Datasheet

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8-Pad WSON 6x5mm Cont’d.
Notes:
1. Advanced Packaging Information; please contact Winbond for the latest minimum and maximum specifications.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package.
4. The metal pad area on the bottom center of the package is connected to the device ground (GND pin). Avoid placement of
SOLDER PATTERN
exposed PCB vias under the pad.
SYMBOL
M
Q
N
P
R
MIN
MILLIMETERS
TYP.
3.40
4.30
6.00
0.50
0.75
MAX
- 48 -
MIN
W25X10BV/20BV/40BV
INCHES
0.
0.
0.
0.
0.
TYP
13
16
23
01
02
38
92
60
96
55
.
MAX

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