W25Q40BVSNIG WINBOND [Winbond], W25Q40BVSNIG Datasheet - Page 67

• Manufacturer Part Number: W25Q40BVSNIG
• Description: 4M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
• Manufacturer: WINBOND [Winbond]

10. PACKAGE SPECIFICATION
10.1 8-Pin SOIC 150-mil (Package Code SN)
Notes:
1. Controlling dimensions: inches, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package.
4. Formed leads shall be planar with respect to one another within .0004 inches at the seating plane
SEATING PLANE
SEATING PLANE
Y
Y
SYMBOL
8
8
1
1
E
D
Y
e
H
A1
A
θ
b
c
L
(2)
(3)
(3)
(4)
E
b
b b b
D
D
Min
0.19
1.35
0.10
0.33
3.80
4.80
5.80
0.40
---
0°
MILLIMETERS
e
e
1.27 BSC
5
5
4
4
A1
A1
Max
E H
E H
E H
1.75
0.25
0.51
0.25
4.00
5.00
6.20
0.10
1.27
A
A
10°
- 67 -
E
E
E
0.053
0.004
0.013
0.008
0.150
0.188
0.228
0.016
Min
---
0°
Publication Release Date: July 08, 2010
0.050 BSC
INCHES
.
Max
0.069
0.010
0.020
0.010
0.157
0.196
0.244
0.004
0.050
0.25
0.25
10°
Preliminary - Revision B
W25Q40BV
GAUGE PLANE
GAUGE PLANE
c
c
L
L
θ
θ